Electroplating Process Engineer
2 weeks ago
POSITION: PLATING PROCESS DEVELOPMENT ENGINEER
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR OF PLATING PROCESS DEVELOPMENT
OVERVIEW:
As a key member of the Plating Process Development team, the Plating Process Development Engineer is tasked with formulating and executing strategies aimed at enhancing and refining plating and wet etch methodologies. This role encompasses the design and execution of wafer experiments, thorough data analysis, and the presentation of findings. The engineer will also be responsible for creating and applying practices that minimize costs while boosting operational efficiency, conducting root cause analyses, and implementing necessary corrective measures. Additionally, the role involves developing procedures for the seamless transition of new products into production and ensuring that all documentation and process instructions are current and accurate.
KEY RESPONSIBILITIES:
- Formulates and implements innovative strategies for the enhancement of wafer plating, wet etch, and stripping processes.
- Establishes and executes methodologies aimed at cost reduction and operational efficiency improvement.
- Conducts root cause investigations and implements corrective actions as necessary.
- Designs and develops processes for the effective transition of new products into production.
- Regularly reviews, updates, and maintains all relevant documentation and process instructions.
- Provides guidance to operators and technicians on processes and modifications to existing procedures.
- Collaborates with equipment and maintenance teams to minimize downtime and integrate new tools into production.
- Designs experiments, analyzes results, and formulates recommendations for performance improvement and cost reduction.
- Works closely with various departments, including process and product engineering, to develop new processes that reduce waste and enhance yield.
- Responds to inquiries from team members and management.
- Adheres to all safety regulations and protocols.
- Performs additional duties as required.
MINIMUM REQUIREMENTS:
- Master's degree in Chemical or Electrical Engineering, Materials Science, or Physics, or equivalent relevant experience; PhD preferred.
- A minimum of three years of hands-on experience in the magnetic recording head, hard disk drive, or semiconductor sectors, specifically in thin film plating or process engineering.
- Proficient in JMP, SPC, or similar analytical software.
- Skilled in Microsoft Office Suite applications.
SKILLS AND COMPETENCIES:
- In-depth knowledge of thin film plating and wet etch development processes.
- Familiarity with wafer fabrication techniques and tools.
- Proficient in using Microsoft Office applications for documentation and presentations.
- Adept at designing experiments, analyzing data, and recommending corrective actions to enhance yield.
- Strong verbal and written communication skills for effective interaction with all organizational levels.
- Ability to work collaboratively and productively with colleagues at all levels.
- Commitment to safety protocols and procedures.
- Excellent organizational and time management abilities.
- Strong problem-solving and troubleshooting skills.
- Flexibility and capability to prioritize tasks effectively.
The annual base salary for this full-time position is competitive and commensurate with experience, including a bonus target and benefits. The salary range may vary based on job responsibilities, knowledge, skills, abilities, education, and experience.
WORK ENVIRONMENT:
The Plating Process Development Engineer primarily operates in an office setting, with potential travel between buildings as needed. The role may also involve work in a controlled manufacturing environment, adhering to safety and dress standards. Exposure to hazardous materials and noise may occur, and the position requires various physical activities, including standing, walking, and fine motor skills.
Headway Technologies, Inc. is committed to providing equal employment opportunities to all employees and applicants without regard to race, color, religion, gender, national origin, age, disability, or genetics. Accommodation requests for the application process should be directed to the Human Resources Department.
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