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Senior Plating Process Engineer

2 months ago

Milpitas, California, United States Headway Technologies, Inc. Full time

POSITION: PLATING PROCESS DEVELOPMENT ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR OF PLATING PROCESS DEVELOPMENT

OVERVIEW:

Under the supervision of the Director of Plating Process Development, the Plating Process Development Engineer plays a crucial role in formulating and executing strategies aimed at enhancing and refining plating and wet etch methodologies. This position involves designing and executing wafer experiments, interpreting data, and presenting findings. The engineer will also focus on developing and instituting practices that lower costs and boost operational efficiency, performing root cause analysis, and implementing corrective measures. Furthermore, this role encompasses creating and enforcing procedures for the seamless transition of new products into production, alongside reviewing and maintaining process documentation.

KEY RESPONSIBILITIES:

  • Formulates and implements innovative strategies for enhancing wafer plating and wet etch processes.
  • Establishes practices that minimize costs while improving operational efficiency.
  • Conducts thorough root cause analyses and applies corrective actions as necessary.
  • Creates and enforces processes for integrating new products into the production workflow.
  • Regularly reviews, updates, and maintains documentation and process guidelines.
  • May provide training to operators and technicians on processes and modifications.
  • Collaborates with equipment and maintenance teams to reduce tool downtime and facilitate the integration of new tools.
  • Designs and executes experiments, analyzes results, and formulates recommendations to enhance performance and reduce costs.
  • Works in partnership with various departments, including process and product engineering, to develop new processes that minimize scrap and enhance yield.
  • Responds to inquiries from team members and management.
  • Adheres to all safety protocols and procedures as mandated.
  • Performs additional duties of a similar nature or level as required.


MINIMUM REQUIREMENTS:

  • Master's degree in Chemical or Electrical Engineering, Materials Science, or Physics, or equivalent relevant experience; PhD preferred.
  • A minimum of three years of hands-on experience in the magnetic recording head, hard disk drive, or semiconductor sectors, specifically in thin film plating or process engineering.
  • Proficient in using JMP, SPC, or similar analytical software.
  • Skilled in Microsoft Office applications.

KNOWLEDGE, SKILLS, AND ABILITIES:

  • In-depth knowledge of thin film plating and wet etch development and manufacturing processes.
  • Familiarity with wafer fabrication techniques and tools.
  • Ability to utilize Microsoft Office applications for creating spreadsheets, documents, and presentations.
  • Capable of designing experiments, analyzing outcomes, and recommending corrective actions to enhance yield.
  • Effective communication skills, both verbal and written, across all levels of the organization.
  • Able to collaborate productively with colleagues and management.
  • Commitment to adhering to safety policies and procedures.
  • Strong organizational and time management skills.
  • Proven problem-solving and troubleshooting abilities.
  • Flexibility and capability to prioritize tasks effectively.

The annual base salary for this full-time position is competitive and commensurate with experience, including a bonus target and benefits. The specific salary may vary based on job responsibilities, relevant knowledge, skills, abilities, education, and experience.

WORK ENVIRONMENT:

The Plating Process Development Engineer primarily operates in an office setting during standard business hours. The schedule may be adjusted as necessary to meet operational needs. Occasional travel between facilities may be required. The role may also involve working in a controlled manufacturing environment, adhering to safety and dress standards. Exposure to hazardous materials and noise may occur in the manufacturing facility. The position requires standing, walking, and performing various manual tasks, including operating a computer and other office equipment.

Headway Technologies, Inc. is an equal opportunity employer, providing fair employment opportunities to all employees and applicants without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants needing accommodation during the application process should contact the Human Resources Department.