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Senior Plating Process Engineer

2 months ago

Milpitas, California, United States Headway Technologies, Inc. Full time

TITLE: PLATING PROCESS DEVELOPMENT ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR, PLATING PROCESS DEVELOPMENT

SUMMARY:

Under the guidance of the Director of Plating Process Development, the Plating Process Development Engineer plays a crucial role in formulating and executing strategies aimed at enhancing and refining plating and wet etch methodologies. This includes designing and executing wafer experiments, analyzing results, and presenting findings. The engineer will also focus on developing and implementing practices that lower costs and boost operational efficiency, conducting root cause analyses, and applying corrective measures. Furthermore, the role involves creating and enforcing procedures for the seamless transition of new products into production and ensuring the accuracy and currency of documentation and process instructions.

ESSENTIAL FUNCTIONS:

  • Formulates and implements innovative strategies for the enhancement of wafer plating, wet etch, and stripping processes.
  • Establishes and applies methodologies that aim to reduce costs while improving operational efficiency.
  • Conducts thorough root cause analyses and implements necessary corrective actions.
  • Designs and executes processes for the effective transition of new products into production.
  • Maintains, reviews, and updates documentation and process instructions.
  • May provide training to operators and technicians on processes and modifications.
  • Collaborates with equipment and maintenance teams to minimize tool downtime and facilitate the integration of new tools into production.
  • Designs experiments, analyzes data, and formulates recommendations to enhance performance and reduce costs based on experimental outcomes.
  • Works in partnership with other departments, including process and product engineering, to develop and implement new processes that minimize scrap and enhance yield.
  • Responds to inquiries from team members, management, and other departments.
  • Adheres to all safety policies and procedures as mandated.
  • Performs additional duties of a similar nature or level as required.


MINIMUM QUALIFICATIONS:

  • Master's degree in Chemical or Electrical Engineering, Materials Science, or Physics, or equivalent relevant experience; PhD preferred.
  • A minimum of three years of hands-on experience in the magnetic recording head, hard disk drive, or semiconductor industry, specifically in thin film plating or process engineering.
  • Proficient in JMP, SPC, or similar analytical software.
  • Skilled in Microsoft Office Applications.

Knowledge, Skills, and Abilities:

  • In-depth knowledge of thin film plating and wet etch development and manufacturing processes.
  • Familiarity with wafer fabrication processing techniques and tools.
  • Proficient in using Microsoft Office applications for creating spreadsheets, documents, and presentations.
  • Able to design experiments, analyze results, and recommend corrective actions to enhance yield and minimize scrap.
  • Effective communication skills, both verbal and written, with all levels of personnel.
  • Ability to work collaboratively and productively with diverse teams.
  • Commitment to adhering to all safety policies and procedures.
  • Strong organizational and time management capabilities.
  • Demonstrated problem-solving and troubleshooting skills.
  • Flexibility and ability to prioritize tasks effectively.

The annual base salary for this full-time position is competitive, with additional bonus potential and benefits. Compensation may vary based on job responsibilities, relevant knowledge, skills, abilities, education, and experience.

WORKING CONDITIONS:

The Plating Process Development Engineer primarily operates in an office environment, with a standard Monday to Friday schedule. Flexibility in scheduling may be required to meet operational needs. The role may involve occasional travel between facilities and may require work in a controlled manufacturing environment, adhering to specific safety and dress standards. Exposure to hazardous materials, fumes, or excessive noise may occur in the manufacturing setting. The position involves standing, walking, and performing fine motor tasks, as well as operating office equipment.

TDK/Headway Technologies, Inc. is committed to providing equal employment opportunities (EEO) to all employees and applicants without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation to complete the application process should contact the Human Resources Department.