Senior Plating Process Engineer

2 weeks ago

Milpitas, California, United States Headway Technologies, Inc. Full time

POSITION: PLATING PROCESS DEVELOPMENT ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR, PLATING PROCESS DEVELOPMENT

OVERVIEW:

Under the guidance of the Director of Plating Process Development, the Plating Process Development Engineer plays a crucial role in formulating and executing strategies aimed at enhancing and refining plating and wet etch processes. This includes designing and performing wafer experiments, analyzing results, and presenting findings. The engineer will also focus on developing and applying methodologies that minimize costs while boosting operational efficiency, conducting root cause analyses, and implementing corrective measures. Additionally, the role involves creating and executing procedures for the seamless transition of new products into production, as well as reviewing and maintaining essential documentation and process instructions.

KEY RESPONSIBILITIES:

  • Formulates and implements innovative strategies for the enhancement of wafer plating and wet etch processes.
  • Establishes and applies methodologies that lead to cost reductions and improved operational efficiency.
  • Conducts thorough root cause analyses and initiates corrective actions as necessary.
  • Creates and executes processes for the effective transition of new products into production.
  • Reviews, updates, and maintains critical documentation and process instructions.
  • May provide training to operators and technicians on processes and procedures, including modifications to existing protocols.
  • Collaborates with equipment and maintenance teams to minimize tool downtime and integrate new tools into production.
  • Designs and conducts experiments, analyzes data, and formulates recommendations for performance improvements or cost reductions based on experimental results.
  • Works closely with other departments, including process and product engineering, to develop and implement new processes that reduce scrap and enhance yield.
  • Responds to inquiries from team members, managers, or other departments.
  • Adheres to all safety policies and procedures as required.
  • Performs additional duties of a similar nature or level as needed.


MINIMUM REQUIREMENTS:

  • Master's degree in Chemical or Electrical Engineering, Materials Science, or Physics, or equivalent relevant experience; PhD preferred.
  • A minimum of three years of hands-on experience in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film plating or process engineering capacity.
  • Strong proficiency in using JMP, SPC, or similar analytical software.
  • Proficient in Microsoft Office applications.

KNOWLEDGE, SKILLS, AND ABILITIES:

  • In-depth knowledge of thin film plating and wet etch development and manufacturing processes.
  • Familiarity with wafer fabrication processing techniques and tools.
  • Ability to utilize Microsoft Office applications for creating spreadsheets, documents, and presentations.
  • Competence in designing experiments, analyzing results, and recommending corrective actions to reduce scrap and enhance yield.
  • Effective communication skills, both verbal and written, with all levels of personnel.
  • Ability to work collaboratively and productively with all levels of staff and management.
  • Commitment to complying with all safety policies and procedures.
  • Demonstrated organizational and time management skills.
  • Strong problem-solving and troubleshooting abilities.
  • Flexibility and ability to prioritize tasks effectively.

The annual base salary for this full-time position is competitive and includes a bonus target along with benefits. Compensation may vary based on factors such as job responsibilities, relevant knowledge, skills, education, and experience. The salary range is subject to periodic adjustments.

WORK ENVIRONMENT:

The Plating Process Development Engineer primarily operates in an office setting from Monday to Friday, with potential adjustments to the schedule as necessary to meet operational needs. The role may involve travel between buildings as required. The engineer may also work in a controlled manufacturing environment, adhering to established safety and dress standards. Exposure to hazardous materials, fumes, or noise may occur in the manufacturing facility. The position requires standing, walking, and performing various manual tasks, including operating a computer and other office equipment.

Headway Technologies, Inc. is an equal opportunity employer, providing fair employment opportunities to all employees and applicants without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation during the application process should contact the Human Resources Department.

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