Senior Plating Process Engineer

2 weeks ago

Milpitas, California, United States Headway Technologies, Inc. Full time

TITLE: PLATING PROCESS DEVELOPMENT ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR, PLATING PROCESS DEVELOPMENT

SUMMARY:

Under the guidance of the Director of Plating Process Development, the Plating Process Development Engineer is tasked with formulating and executing strategies aimed at enhancing and refining plating and wet etch processes. This role involves designing and performing wafer experiments, analyzing resultant data, and documenting findings. The engineer will also focus on developing and implementing methodologies that lower costs and boost operational efficiency, conducting root cause analyses, and executing corrective actions as necessary. Additionally, this position is responsible for establishing procedures for the seamless transition of new products into production and ensuring that all documentation and process instructions are current and accurate.

ESSENTIAL FUNCTIONS:

  • Formulates and implements innovative strategies for enhancing wafer plating and wet etch processes.
  • Establishes and applies methodologies that effectively reduce costs while improving operational efficiency.
  • Conducts thorough root cause analyses and initiates corrective actions when necessary.
  • Creates and enforces processes for the integration of new products into the production workflow.
  • Regularly reviews, updates, and maintains comprehensive documentation and process instructions.
  • May provide training to operators and technicians on processes and procedures, including updates to existing protocols.
  • Collaborates with equipment and maintenance teams to minimize tool downtime and facilitate the integration of new tools into production.
  • Designs and executes experiments, interprets data, and formulates recommendations for performance enhancement or cost reduction based on experimental outcomes.
  • Works in partnership with various departments, including process and product engineering, to develop and implement new processes that minimize scrap and enhance yield.
  • Responds to inquiries from team members, management, and other departments.
  • Adheres to all safety regulations and protocols as mandated.
  • Performs additional duties of a similar nature or level as required.


MINIMUM QUALIFICATIONS:

  • Master's degree in Chemical or Electrical Engineering, Materials Science, or Physics, or equivalent relevant experience; PhD preferred.
  • A minimum of three years of hands-on experience in the magnetic recording head, hard disk drive, or semiconductor sectors in a thin film plating or process engineering capacity.
  • Proficient in utilizing JMP, SPC, or comparable software.
  • Skilled in Microsoft Office Applications.

Knowledge, Skills, and Abilities:

  • Comprehensive understanding of thin film plating and wet etch development and manufacturing processes.
  • Familiarity with wafer fabrication processing techniques and tools.
  • Proficient in Microsoft Office applications for creating spreadsheets, documents, and presentations.
  • Adept at designing experiments, analyzing results, and recommending corrective actions to minimize scrap and enhance yield.
  • Effective communication skills, both verbal and written, with all levels of personnel.
  • Ability to work collaboratively and productively with all levels of staff and management.
  • Commitment to complying with all safety policies and procedures.
  • Demonstrated organizational and time management capabilities.
  • Strong problem-solving and troubleshooting skills.
  • Flexibility and ability to prioritize tasks effectively.

The annual base salary for this full-time position is competitive and includes a bonus target along with benefits. Compensation may vary based on job responsibilities, relevant knowledge, skills, abilities, education, and experience.

WORKING CONDITIONS:

The Plating Process Development Engineer primarily operates in an office setting from Monday to Friday, with potential adjustments to the schedule as needed for business requirements. This role may involve travel between buildings and may also require work in a controlled manufacturing environment. Adherence to safety and dress standards is mandatory. The engineer may encounter hazardous materials, fumes, or excessive noise in the manufacturing facility and will engage in various physical activities, including standing, walking, and fine motor tasks. The role may also involve the occasional lifting of objects weighing 10 pounds or more.

Headway Technologies, Inc. is an equal opportunity employer, providing employment opportunities without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodations for the application process should contact the Human Resources Department.

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