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Electroplating Process Engineer

2 months ago

Milpitas, California, United States Headway Technologies Full time

POSITION: PLATING PROCESS DEVELOPMENT ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR OF PLATING PROCESS DEVELOPMENT

OVERVIEW:

Under the guidance of the Director of Plating Process Development, the Plating Process Development Engineer plays a crucial role in formulating and executing innovative strategies aimed at enhancing and refining plating and wet etch processes. This position involves designing and conducting moderately complex experiments on wafers, analyzing the resulting data, and presenting findings. The engineer will also be responsible for developing and implementing new methodologies that aim to lower costs and boost operational efficiency, conducting root cause analyses, and instituting corrective measures. Furthermore, the role includes the transition of new products into production, along with the review and maintenance of relevant documentation and process instructions.

KEY RESPONSIBILITIES:

  • Formulates and executes strategies for the enhancement and optimization of wafer plating and wet etch processes.
  • Implements innovative practices aimed at cost reduction and operational efficiency improvement.
  • Conducts root cause analyses and takes corrective actions as necessary.
  • Develops and implements processes for the smooth transition of new products into production.
  • Monitors prototype wafers to ensure seamless movement through the plating or wet etch processes.
  • Reviews, updates, and maintains essential documentation and process instructions.
  • May provide instruction to operators and technicians regarding processes and procedural modifications.
  • Collaborates with equipment and maintenance teams to minimize tool downtime and facilitate the integration of new tools into production.
  • Designs and conducts moderately complex experiments, analyzes data, and formulates recommendations for performance enhancement or cost reduction based on experimental results.
  • Partners with various departments, including process and product engineering, to develop and implement new processes that reduce scrap and enhance yield.
  • Responds to inquiries from team members, managers, or other departments.
  • Adheres to all safety policies and procedures as required.
  • Performs additional duties of a similar nature or level as needed.

MINIMUM REQUIREMENTS:

  • Bachelor's degree in Chemical or Electrical Engineering, Materials Science, or Physics, or equivalent relevant experience; a Master's degree is preferred.
  • One to three years of hands-on experience in the magnetic recording head, hard disk drive, or semiconductor industry, specifically in a thin film plating or process engineering capacity.
  • Strong proficiency in JMP, SPC, or similar analytical software.
  • Proficient in Microsoft Office applications.

KNOWLEDGE, SKILLS, AND ABILITIES:

  • Comprehensive understanding of thin film plating and wet etch development and manufacturing processes.
  • Familiarity with wafer fabrication processing techniques and tools.
  • Ability to utilize Microsoft Office applications for creating spreadsheets, documents, and presentations.
  • Capable of designing moderately complex experiments, analyzing results, and recommending corrective actions to minimize scrap and enhance yield.
  • Effective communication skills, both verbal and written, with all levels of personnel.
  • Able to work collaboratively and productively with diverse teams.
  • Commitment to complying with all safety policies and procedures.
  • Demonstrated organizational and time management skills.
  • Proven problem-solving and troubleshooting abilities.
  • Flexible and adept at prioritizing tasks.

The annual base salary for this full-time position is competitive, with additional benefits and bonus potential. Compensation may vary based on job responsibilities, relevant knowledge, skills, and experience.

WORKING ENVIRONMENT:

The Plating Process Development Engineer primarily operates in an office setting during standard business hours. The schedule may be adjusted as necessary to meet operational demands. The role may involve occasional travel between facilities and may require work in a controlled manufacturing environment, adhering to safety and dress standards. Exposure to hazardous materials, fumes, or noise may occur in the manufacturing facility. The position requires various physical activities, including standing, walking, and operating office equipment.

Headway Technologies, Inc. is an equal opportunity employer, providing employment opportunities without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation to complete the application process should contact the Human Resources Department.