Senior Plating Process Engineer

1 week ago

Milpitas, California, United States Headway Technologies, Inc. Full time

POSITION: PLATING PROCESS DEVELOPMENT ENGINEER

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR, PLATING PROCESS DEVELOPMENT

OVERVIEW:

Under the guidance of the Director of Plating Process Development, the Plating Process Development Engineer plays a crucial role in formulating and executing strategies aimed at enhancing and refining plating and wet etch methodologies. This position involves designing and performing wafer experiments, interpreting the results, and presenting findings. The engineer will also focus on developing and applying practices that lower costs while boosting operational efficiency, conducting root cause analyses, and implementing necessary corrective measures. Additionally, the role includes creating and enforcing procedures for the seamless transition of new products into production and ensuring that documentation and process instructions are consistently updated and maintained.

KEY RESPONSIBILITIES:

  • Formulates and implements innovative strategies for the enhancement of wafer plating, wet etch, and stripping processes.
  • Establishes and executes methodologies aimed at cost reduction and operational efficiency improvement.
  • Conducts thorough root cause analyses and initiates corrective actions as needed.
  • Creates and enforces processes for the effective transition of new products into production.
  • Regularly reviews, updates, and maintains all relevant documentation and process instructions.
  • May provide training to operators and technicians on processes and procedures, including updates to existing protocols.
  • Collaborates with equipment and maintenance teams to minimize tool downtime and facilitate the integration of new tools into production.
  • Designs and executes experiments, analyzes data, and formulates recommendations for performance enhancement or cost reduction based on experimental outcomes.
  • Works in partnership with various departments, including process and product engineering, to develop and implement new processes that reduce scrap and enhance yield.
  • Responds to inquiries from team members, management, and other departments.
  • Adheres to all safety regulations and protocols as required.
  • Performs additional duties of a similar nature or level as necessary.


MINIMUM REQUIREMENTS:

  • Master's degree in Chemical or Electrical Engineering, Materials Science, or Physics, or equivalent relevant experience; PhD preferred.
  • A minimum of three years of hands-on experience in the magnetic recording head, hard disk drive, or semiconductor sectors in a thin film plating or process engineering capacity.
  • Proficient in utilizing JMP, SPC, or comparable software.
  • Skilled in Microsoft Office applications.

KNOWLEDGE, SKILLS, AND ABILITIES:

  • In-depth knowledge of thin film plating and wet etch development and manufacturing processes.
  • Familiarity with wafer fabrication processing techniques and tools.
  • Ability to effectively use Microsoft Office applications for creating spreadsheets, documents, and presentations.
  • Capable of designing experiments, analyzing results, and recommending corrective actions to minimize scrap and enhance yield.
  • Strong verbal and written communication skills, enabling effective interaction with all levels of personnel.
  • Able to work collaboratively and productively with diverse teams.
  • Commitment to adhering to all safety policies and procedures.
  • Demonstrated organizational and time management capabilities.
  • Proven problem-solving and troubleshooting skills.
  • Flexible and adept at prioritizing tasks.

The annual base salary for this full-time position is competitive, with additional bonus targets and benefits. The specific salary may vary based on factors such as job responsibilities, relevant knowledge, skills, education, and experience.

WORKING ENVIRONMENT:

The Plating Process Development Engineer primarily operates in an office setting during standard business hours. The schedule may be adjusted as necessary to accommodate business needs. The role may also involve working in a controlled manufacturing environment, adhering to safety and dress standards. Exposure to hazardous materials and noise may occur in the manufacturing facility. Physical activities may include standing, walking, and performing fine motor tasks, as well as operating office equipment.

Headway Technologies, Inc. is committed to providing equal employment opportunities (EEO) to all employees and applicants without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodations to complete the application process should reach out to the Human Resources Department.

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