Technical Packaging Manager

6 days ago


Boise, Idaho, United States Micron Technology Full time
About the Role

We are seeking a highly skilled Technical Packaging Manager - DRAM to join our team at Micron Technology. As a key member of our Package Development Engineering organization, you will be responsible for leading the development of innovative Compute DRAM Package products.

Key Responsibilities
  • Lead a team of engineers to design, develop, and launch new Compute DRAM Package products.
  • Provide technical leadership in package architecture, materials selection, design rules, and reliability.
  • Develop and communicate package enabler roadmaps to global packaging organizations and assembly sites.
  • Lead multi-functional initiatives to deliver next-generation capabilities and position Micron's DRAMs as industry leaders.
  • Collaborate with leadership and other functional areas to develop business processes that enhance package development operational efficiencies.
  • Apply business insight to achieve packaging and assembly strategic outcomes.
  • Provide technical leadership in customer interfaces to drive next-generation requirements and package technology.
Requirements and Skills
  • Strong technical leadership and program management skills.
  • Ability to serve as an encouraging leader in packaging.
  • Own the development of programs essential to Micron packaging and ensure execution of the function.
  • Ensure programs are aligned with customers' current and future needs and expectations.
  • Participate in setting package strategy for Micron.
  • Make decisions that significantly impact the future success of Micron's package solutions and its ability to compete in the marketplace.
  • Have a broad global reach.
  • Apply deep knowledge of packaging to guide strategy and develop roadmaps, solve sophisticated problems, and develop other team members.
  • Must be able to work independently with minimal direction.
Education and Experience
  • Bachelor's, Master's, or Ph.D. in an Engineering field.
  • 10+ years of proven experience in packaging engineering.
  • Program management and soft skills.
  • The ideal candidate will have engineering experience with High Bandwidth Memory (HBM) manufacturing, TSV, CoW, CSP, fan-out, fan-in, and other advanced packaging technologies.
Qualifications
  • Proficient in English written and verbal communication.
  • Demonstrate clear communication of technical issues to Company Executives.
  • Deep knowledge of Assembly Process, Equipment, Materials, and Integration.


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