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Technical Packaging Manager
2 months ago
Micron Technology is seeking a highly skilled Technical Packaging Manager to lead the development of innovative Compute DRAM packages. As a key member of the Package Development Engineering organization, you will be responsible for ensuring the successful execution of all New Product Development processes, from concept to launch.
Key Responsibilities- Lead a team of packaging experts to design and develop next-generation Compute DRAM packages.
- Provide technical leadership in package architecture, materials selection, design rules, and reliability.
- Develop and communicate package enabler roadmaps to global packaging organizations and assembly sites.
- Collaborate with business leaders and functional areas to develop business processes that enhance package development operational efficiencies.
- Apply business insight to achieve strategic outcomes in packaging and assembly.
- Provide technical leadership in customer interfaces to drive next-generation requirements and package technology.
- 10+ years of experience in packaging engineering, with a strong background in High Bandwidth Memory (HBM) manufacturing.
- Proven program management and soft skills.
- Deep knowledge of advanced packaging technologies, including TSV, CoW, CSP, fan-out, and fan-in.
- Excellent written and verbal communication skills in English.
- Ability to work independently with minimal direction.
Micron Technology is committed to the growth and development of our employees. We offer a comprehensive benefits package, including medical, dental, and vision plans, as well as paid time off and holidays. We are an equal opportunity employer and welcome applications from diverse candidates.
