Plating Manufacturing Technician
4 weeks ago
TITLE: PLATING ME TECHNICIAN
C SHIFT: FRIDAY THRU SUNDAY AND EVERY OTHER THURSDAY FROM 6:00 AM TO 6:00 PM
REPORTS TO: DIRECTOR, PLATING MANUFACTURING ENGINEERING
SUMMARY:
Under the direction of the Director of Plating Manufacturing Engineering, the Plating ME Technician provides support to the manufacturing and engineering teams in the plating area, assists and supports wafer fab production, reviews and documents processes or procedures, and dispositions abnormal wafers for rework; maintains process controls using Statistical Process Control (SPC), collects and analyzes data, and recommends corrective action; supports activities related to improved manufacturing efficiency This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:
- Provides support to the manufacturing and engineering teams in the plating area
- Supports wafer fab production and manufacturing processes to ensure that wafers are processed efficiently and cost effectively
- Reviews and documents processes and procedures; partners with engineering to implement changes effectively and with minimal disruption
- Dispositions abnormal or atypical wafers for rework; ensures that rework is completed promptly
- Collects and analyzes data and recommends corrective action if required
- Reviews and maintains process controls using SPC and prepares charts and graphs as needed
- Assists with trouble-shooting tools and process issues in the plating area
- Participates in and recommends modifications to procedures or processes in support of continuous improvement initiatives
- Assists with training and certifying operators on various tools and manufacturing processes
- Collaborates with manufacturing or engineering to qualify or approve new processes or procedures and may assist with identifying production integration timelines
- Responds to inquiries from other team members, managers, or departments
- Overtime may be required contingent on business needs
- Adheres to all safety policies and procedures as required
- Performs other duties of a similar nature or level*
MINIMUM QUALIFICATIONS:
- Associates degree in Electronics, Industrial Engineering, or Manufacturing Technology and/or equivalent relevant experience
- Two years of experience working in the semiconductor industry in a high volume manufacturing environment
- Strong knowledge of electronics and manufacturing processes
- Proficient in the use of Microsoft Office Applications
Required Knowledge, Skills, and Abilities:
- Knowledge and ability to use various types of plating tools or wet etch equipment
- Knowledge of the semiconductor and hard disk drive industry principles, practices, and techniques
- Knowledge of and ability to use MS Office, including Word, Excel, Power Point, and Access to analyze data, create documents, spreadsheets, and presentations
- Knowledge and ability to use SPC to maintain process controls
- Ability to collect and analyze data using SPC, including presenting findings and recommending corrective action
- Ability to troubleshoot various types of tools and tool sets to ensure minimal downtime
- Ability to adhere to all safety policies and procedures
- Ability to communicate, both verbally and in writing, with contractors, consultants, employees, management, and vendors
- Demonstrated ability to problem solve
- Skilled at time management
- Skilled at resolving issues quickly and efficiently
- Flexible and able to prioritize
The hourly rate for this full-time position is between $25.29-$37.94 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:
The Plating ME Technician works primarily in an indoor environment on a rotating schedule on C shift which is Friday thru Sunday and every other Thursday from 6:00 AM to 6:00 PM. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally be required to push, pull, or lift up to 30 pounds.
*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department
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