Lead Process Engineer for Wafer Edge Shaping

2 weeks ago

Santa Clara, California, United States Halo Industries Full time

The Opportunity
As Halo Industries increases its production capabilities, we are in search of a seasoned process engineer to enhance wafer fabrication methodologies that meet client requirements and sustain production workflows for various equipment including grinders, polishers, and cleaning systems.

This specific position will concentrate on the equipment and processes involved in the shaping of wafer edges.

Job Description
In the role of Senior Process Engineer, your key responsibilities will include:

  • Acting as the primary process engineer for edge shaping at Halo Industries, focusing on grinding machinery and associated metrology.
  • Establishing process recipes and equipment operating parameters to meet customer specifications.
  • Addressing customer feedback and pinpointing areas for quality enhancement.
  • Conducting practical experiments to refine performance, cost efficiency, and throughput of wafer fabrication processes, including grinding, cleaning, and related metrology tools.
  • Gaining a comprehensive understanding of diverse semiconductor processing tools to assist the production team with troubleshooting, maintenance, and training.
  • Collaborating with third-party vendors to continuously assess and remain informed about industry best practices.
  • Working innovatively and collaboratively with other teams at Halo to devise new wafer fabrication techniques.
  • Analyzing production data from metrology tools to track and enhance wafer defectivity and geometry.
  • Compiling, summarizing, and presenting findings to team members.

Requirements
Preferred Education & Experience
The ideal candidate will possess a recent MS or PhD with over 3 years of relevant experience (or a BS with over 5 years of relevant experience) in engineering, science, or a related field. Candidates with greater levels of experience are also encouraged to apply.

What We're Looking For
Exceptional detail-oriented analytical, creative, and problem-solving abilities, with a capacity for critical thinking to diagnose issues and optimize intricate processes.

  • Strong understanding of and intuition for physical processes, both mechanical and chemical.
  • Experience operating complex production or laboratory equipment.
  • Familiarity with various metrology tools and optical inspection methods.
  • Excellent communication skills and the ability to collaborate effectively within an interdisciplinary team.
  • Capability to manage multiple priorities with a proactive and positive attitude.

Bonus Qualifications
Direct hands-on experience with wafer edge grinding equipment, strong programming and data analysis skills using languages such as Python or Matlab, or software like JMP or Minitab. Experience with statistical process control in a high-precision manufacturing setting and familiarity with design-of-experiment methodologies.

Benefits
$130-150k Base Salary
Health Care Plan (Medical, Dental & Vision)
Retirement Plan (401k, IRA)
Paid Time Off (Vacation, Sick & Public Holidays)
Family Leave (Maternity, Paternity)
Stock Option Plan

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