Advanced Engineering Research Scientist

2 weeks ago


Arlington, Virginia, United States The University of Texas at Arlington Full time
Position Overview

The University of Texas at Arlington is seeking a dedicated and innovative Research Engineering Scientist Associate V to join our esteemed Mechanical and Aerospace Engineering Department. This full-time role is situated in Arlington and offers a competitive salary based on qualifications and relevant experience, with a maximum of $90,000.

Key Responsibilities
  • Conduct pioneering research focused on the heterogeneous integration of diverse systems in packaging (2.5D/3.5D), emphasizing reliability.
  • Investigate and identify suitable materials for heterogeneous integration, including semiconductors, dielectrics, and conductors.
  • Explore emerging materials to enhance performance.
  • Collaborate with interdisciplinary teams to design, develop, and optimize manufacturing processes for heterogeneous integration, ensuring reliability and scalability.
  • Examine advanced interconnection methods and technologies, such as through-silicon vias (TSVs), micro bumps, and hybrid bonding for 2.5D/3.5D packaging.
  • Utilize modeling and simulation tools to predict the behavior of integrated systems, identifying potential challenges and optimizing designs.

Essential Duties
  • Engage in research related to heterogeneous integration, including advanced interconnects and thermal management techniques.
  • Prepare research proposals, collaborate with PhD candidates, and publish findings.
  • Work with research partners to develop new testing procedures and methodologies.
  • Perform material characterization for thin films and advanced interconnects.

Qualifications

Minimum Requirements
  • Ph.D. in engineering or a relevant combination of education and professional certification.

Preferred Qualifications
  • Ph.D. in mechanical or electrical engineering, with at least 2 years of related research experience.

Knowledge, Skills, and Abilities
  • Proficient in designing and building micro-electronic reliability test platforms.
  • Experience in process integration and development for advanced packaging and interconnects.
  • Familiarity with Si-photonics integration.
  • Expertise in thin film characterization and analysis.
  • Experience with SEM, FIB, Nano-indentation, and AES.
  • Proficient in FEM simulation/modeling.

Working Environment
  • University research laboratory setting.

EEO Statement

The University of Texas at Arlington is committed to providing an inclusive educational and working environment that offers equal opportunity to all members of the university community. The university prohibits unlawful discrimination on various grounds, ensuring a respectful and supportive atmosphere for all individuals.

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