Lead Microelectronics Packaging Specialist

2 weeks ago

Richardson Texas, United States CAES Full time

About Us:
At CAES, we are dedicated to delivering essential electronic solutions that safeguard lives. We invite you to leverage your innovative thinking and analytical skills to transform our concepts into tangible products.

As a key player in the defense and aerospace sectors, CAES engineers solutions for the most critical missions worldwide.


Are you seeking a role that presents challenging and varied projects? Do you desire a position within a company that promotes long-term career growth? Are you looking for an organization that prioritizes a diverse, collaborative environment? If so, CAES is the place for you.



Overview:


We are on the lookout for a Senior/Principal Microelectronic Process/Packaging Engineer to join our team. This position is integral to our MMIC Design Center organization within CAES Defense Systems.

The MMIC Design Center is a dynamic team of over 20 designers specializing in advanced RF solutions for both internal and external clients.

Our center is equipped with project management, testing, and support engineering to translate designs into final products, as well as system expertise to assist with customer architectures and trade studies, enhancing CAES capabilities at board and sub-array levels.

We encourage you to consider joining our team.


The ideal candidate will possess a robust technical engineering background, with expertise in materials and analytical processes. Experience in designing, developing, implementing, and qualifying advanced microelectronics packaging and assembly technology is essential, along with the ability to collaborate across functions in a matrix organization to achieve operational success.


Responsibilities:
- Identify, design, develop, and qualify microelectronic packages to support new product development initiatives.


- Collaborate with internal and external stakeholders to understand, define, and document IC package requirements in alignment with product specifications (Mil-Aero, Space, Commercial).


- Select suitable material sets, perform 3D-CAD modeling, and engage with packaging vendors to create IC Packages that meet quality and reliability standards.


- Utilize CAD design and simulation tools for thermal and mechanical modeling, as well as the design of assembly fixtures and hardware.

- Prepare mechanical drawings and documentation related to package development, including procedures, procurement, training, and maintenance specifications.

- Provide technical insights and recommendations on package and assembly technologies.

- Implement cost-effective continuous improvement initiatives to enhance manufacturability, quality, and reliability of products.


- Use Microsoft Office suite to develop schedules, monitor progress and costs, and generate reports to support program management.


- Maintain a comprehensive understanding of manufacturing equipment to aid in the development of efficient manufacturing processes.

- Conduct and/or support failure analysis efforts to identify root causes and implement effective corrective actions for manufacturing challenges.

- Collaborate with manufacturing engineering to ensure design-for-manufacturing and design-for-reliability principles are adhered to.

- Provide timely risk and opportunity assessments, decision-making, and root cause corrective actions (RCCAs).

- Coordinate document and drawing releases with engineering, design, and material planning teams.

- In conjunction with the lead engineer and supply chain, contribute to vendor selection and development activities.

- Perform additional related duties as assigned.

Core Competencies:
- Knowledge of both legacy and advanced microelectronic packaging technologies, materials, and manufacturing processes, including plating, flip chip, and wire bond assembly.

- Experience in thermal-mechanical stress analysis modeling using FEM tools (CTE mismatch, solder stress, reliability, etc.).


- Familiarity with microelectronic package assembly processes, including wafer bumping, wafer grinding, die attach, wire bonding, flip chip, epoxy dispensing, solder printing, and mass reflow.

- Proficiency with various assembly materials, including conductive and non-conductive epoxies, underfills, and diverse solder alloys.

- Experience working with package assembly subcontractors.

- Ability to define and execute development tasks and activities in support of product or technology development programs.


- Capability to lead and drive high performance across engineering programs, emphasizing program execution and customer satisfaction.


- Strong technical and engineering judgment, with the ability to make impactful decisions in complex situations, often with incomplete data, while engaging with Subject Matter Experts as needed.

- Excellent written and verbal communication skills.

- Proven ability to analyze data, create reports, and present findings to various stakeholders as required.

- Strong work ethic, self-motivated, and dependable.

- Demonstrated ability to deliver projects on time and collaborate effectively with multidisciplinary teams.

- Proficient in engaging with CAES senior management and both internal and external customers.

Qualifications:

Minimum:
- Bachelor's degree in Mechanical Engineering, Materials Engineering, or Physics.


- A minimum of five (5) years of experience in microelectronics assembly and packaging, including expertise in microelectronics semiconductor package technology design and manufacturing.

- Proven experience in defining and executing development and qualification activities.

- Familiarity with CAD software tools such as SolidWorks and ANSYS Mechanical for 3D modeling and finite element analysis.

- This position requires access to technology, materials, software, or hardware controlled by US export laws. To be eligible, candidates must be classified as a "US Person" under US export laws (or eligible for approval under a U.S. Government export license).

- Ability to obtain and maintain a security clearance.

Preferred:
- Advanced degree in Engineering or Physics.

- Eight (8) or more years of experience in microelectronics assembly and packaging.

- Strong communication skills across functions, management, and customers.

- Experience with GaAs/GaN semiconductor materials and processing.

- IC Packaging experience of GaAs or GaN semiconductor MMIC devices.

- Proficiency in ANSYS HFSS and AWR Analyst for EM simulations.

- Experience with Package Qualification per MIL-PRF Requirements.

- Certification in Lean Six Sigma methodologies.

Salary Range:
$84,000 - $138,000 annually.

Employees may be eligible for a discretionary bonus in addition to base pay.

Compensation within the posted range may vary based on factors such as geographical location, job function, education, and experience of the successful candidate.

CAES offers a comprehensive benefits package, including health insurance, life and disability insurance, 401K, paid holidays, and vacation.

Employment Transparency:

BENEFITS
We prioritize our employees' well-being by providing competitive health, wealth, and wellness benefits from day one.

We also offer learning and development opportunities to help you advance your career.


Additional benefits include:
- Comprehensive PTO, Paid Vacation, and Paid Family Leave Programs.

- Student Loan Repayment Program & Tuition Reimbursement.

- 9/80 Alternate Work Week Schedule.

- Tailored Management/Leadership Training.

- Innovative Medical Programs, Including Family Forming.

ABOUT CAES
CAES is the leading provider of analog and radiation-hardened technology for the United States aerospace and defense industry.

From human spaceflight and exploration to missile defense and electronic warfare, our talented team develops high-performing electronic solutions that consistently meet expectations.


WE ARE AN EQUAL OPPORTUNITIES EMPLOYER
At CAES, we embrace diversity and celebrate new ideas. We believe that the varied backgrounds of our team members inspire creativity and drive innovation.

We welcome all individuals, regardless of race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or genetic information.

We are committed to providing reasonable accommodations to individuals with disabilities throughout the employment process.

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