Principal Reliability Engineer

1 week ago


San Jose, United States Rambus Full time

Overview Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Principal Reliability Engineer to join our Operations team in San Jose, CA. Candidates will be joining some of the brightest inventors and engineers in the world to develop products that make data faster and safer. As a Principal Reliability Engineer, the candidate will be reporting to the Sr Manager, Reliability and is a Full Time position. Rambus is seeking experienced, process-driven Reliability Engineers to join our cross-functional team in supporting Memory Interface product development. Responsibilities Design and debug hardware for HTOL burn-in and Biased HAST boards for reliability qualification and evaluation. Evaluate and Qualify Process node and package technology for mass production. Work with R&D, design, process, package, and product engineers to qualify new process and package technologies and ensure quality of design performance to meet customer reliability requirements. Collaborate with foundries and package houses (OSATs) to assess, characterize, and improve processes and quality. Issue internal process, product and package qualification and evaluation project summaries. Perform Failure Analysis on IC to determine root causes and Issue 8D failure analysis report. Perform ESD HBM, ESD CDM and Latch-up Test. Evaluate and perform Reliability Risk Assessment. Manage and Issue Reliability Qualification and on-going reliability report. Make meeting presentations to discuss project results and product issues. Qualifications Requirements: BS or MS degree in Physics or EE with good experience in CMOS and FinFET components products reliability. Experience with electronic component reliability JEDEC/AEC-Q100 and associated standards a must. Wafer level reliability experience a plus. Good working knowledge of CMOS and FinFET device physics. Good experience in IC components and IC package reliability qualification desired. Wafer level reliability knowledge preferred. Flipchip, BGA, WLCSP Assembly process knowledge preferred. Board Level Reliability knowledge preferred. Working knowledge of commercial and automotive reliability standards (JEDEC, AEC). Knowledge of reliability stress and test methods, failure mechanism acceleration models. Good social and communications skills - comfortable working in multicultural teams. Familiarity with IC components reliability failure modes, mechanisms, and failure analysis techniques preferred. #J-18808-Ljbffr



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