IC Package Development Lead

3 weeks ago


Palo Alto, California, United States Tesla Full time

The IC Package Development Lead will be responsible for developing and implementing advanced IC packaging solutions for Tesla's Dojo and Self-Driving Hardware teams. This role requires expertise in semiconductor packaging technology and the ability to collaborate effectively with cross-functional teams.

Responsibilities
  • Lead the development and implementation of SoC packaging assembly process integration strategies
  • Pursue industry advancements in semiconductor packaging technology and drive implementation for new products
  • Work with OSAT vendors to develop and commercialize advanced packaging solutions
Requirements
  • Bachelor's Degree in a relevant field or equivalent experience
  • 2+ years of experience in semiconductor packaging technology, design, and manufacturing process or equivalent experience and exceptional ability
  • Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
  • Solid experience in advanced packaging assembly processes and failure analysis
  • Excellent engineering problem-solving skills with strong physics and fundamentals
  • Excellent communication skills to work well with internal teams and overseas suppliers
Salary and Benefits

Annual salary: $120,000 - $264,000, plus cash and stock awards, and comprehensive benefits package including medical, dental, vision, 401(k), and employee stock purchase plans.



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