High-Performance IC Package Designer

3 days ago


Palo Alto, California, United States Tesla Full time
About the Role

We are looking for a talented High-Performance IC Package Designer to join our team at Tesla. As a High-Performance IC Package Designer, you will be responsible for designing IC packages for high-performance computing projects, including Self-Driving Hardware and Dojo Super AI Computer.

You will work closely with IC package process, SI/PI, thermal/mechanical, and PCB layout teams to ensure seamless collaboration and execution. Your key responsibilities will include setting up layer stackup and design constraints, executing layout and optimizing design based on design review and SI/PI simulation results, performing feasibility studies, and conducting DRC/DFM checks and LVS checks based on design rules and Verilog netlists.

To be successful in this role, you will need to have an engineering degree in a relevant field or equivalent experience, as well as 2+ years of hands-on experience with flip chip IC package design. You should be proficient in Cadence APD+ and SiP Layout, familiar with Unix, Python, TCL, and MATLAB, and have basic transmission line theory and signal and power integrity fundamentals.

The estimated salary for this role is $180,000 - $238,000 per year, plus cash and stock awards and benefits. Our comprehensive benefits package includes medical, dental, and vision plans with options, healthcare and Dependent Care Flexible Spending Accounts (FSA), 401(k) with employer match and Employee Stock Purchase Plans, Company paid Basic Life, AD&D, short-term and long-term disability insurance, Employee Assistance Program and Sick and Vacation time, Commuter benefits and Employee discounts and perks program.



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