IC Package Process Development Expert
4 days ago
Tesla is looking for an IC Package Process Engineer to join our team. In this role, you will be responsible for developing and implementing advanced IC package designs that meet the requirements of our Self-Driving Hardware and Dojo Super AI Computer projects.
You will work closely with cross-functional groups to ensure seamless integration of SoC packaging assembly process, develop new leading-edge products, and bring advanced packaging solutions from concept to high volume manufacturing.
Responsibilities include:
- Developing and implementing advanced IC package designs
- Collaborating with cross-functional groups to ensure seamless integration of SoC packaging assembly process
- Driving industry innovation in semiconductor packaging technology development
To succeed in this role, you will need:
- Bachelor's Degree in a relevant field, or equivalent experience
- 2+ year experience in semiconductor packaging technology, design, and manufacturing process, or the equivalent in experience and evidence of exceptional ability
- Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
- Solid experience in advanced packaging assembly processes and failure analysis
- Excellent engineering problem-solving skills with strong physics and fundamentals
- Excellent communication skills to work well with internal, cross-functional teams and overseas suppliers
We offer a comprehensive benefits package, including:
- Medical, dental, vision, and 401(k) plans
- Commuter benefits
- Employee discounts and perks program
Estimated Salary: $200,000 per year
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