Senior Advanced Packaging Engineer

4 days ago


Palo Alto, California, United States Tesla Full time
Job Description

We are seeking an IC Package Process Engineer to join our team at Tesla. This highly visible role will contribute to the development and manufacturing of advanced IC packages for our Self-Driving Hardware and Dojo Super AI Computer projects.

The successful candidate will have a strong background in semiconductor packaging technology, design, and manufacturing processes. They will work closely with cross-functional groups to lead SoC packaging assembly process integration, explore new leading-edge products, and bring advanced packaging solutions from concept to high volume manufacturing.

Key Responsibilities:

  • Work with cross-functional groups to lead SoC packaging assembly process integration
  • Explore and drive industry on advance semiconductor packaging technology development for new leading-edge products
  • Work with OSATs vendors to bring advanced packaging solutions from concept to high volume manufacturing
Requirements

To be successful in this role, you will need:

  • Bachelor's Degree in a relevant field, or equivalent experience
  • 2+ year experience in semiconductor packaging technology, design, and manufacturing process, or the equivalent in experience and evidence of exceptional ability
  • Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
  • Solid experience in advanced packaging assembly processes and failure analysis
  • Excellent engineering problem-solving skills with strong physics and fundamentals
  • Excellent communication skills to work well with internal, cross-functional teams and overseas suppliers
Compensation and Benefits

We offer a competitive salary range of $120,000 - $264,000 per year, plus cash and stock awards, and benefits including medical, dental, vision, and 401(k) plans. We also offer commuter benefits, employee discounts, and perks program.

Estimated Salary: $180,000 per year



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