Senior Microelectronics Packaging Engineer

2 weeks ago

Boulder, Colorado, United States BAE Systems USA Full time

Job Overview

US CITIZENSHIP REQUIRED

This position presents a remarkable opportunity in the field of Detector Engineering. You will collaborate with a team of skilled engineers and scientists dedicated to the design and production of micro-electronics packaging for focal plane arrays.

The Engineering, Science and Analysis (ESA) Strategic Capabilities Unit embodies the technical expertise and leadership necessary for delivering high-impact technologies that meet our customers' mission requirements. Our cross-functional teams are devoted to innovation, integrity, continuous learning, and effective execution.

Key Responsibilities:

  • Maintain a consistent and reliable work schedule.
  • Foster and sustain effective working relationships within the department, across Strategic Business Units, and with the Strategic Capabilities Units and the Company. Engage appropriately with colleagues to uphold a positive and productive work atmosphere.
  • Perform additional duties as required.

On-Site Work Environment: This role necessitates regular in-person engagement, requiring you to work on-site five days a week at the primary work location. Occasional travel and local commuting between company campuses and other locations may be necessary.

Working Conditions:

  • Work may take place in an office, laboratory, production floor, cleanroom, or outdoor research environment.
  • Occasional work in production areas may require the use of protective equipment.
  • Access to various facilities may occur under different weather conditions.

Required Education, Experience, & Skills:

  • A Bachelor’s degree or higher in Engineering or a related technical field is essential, along with a minimum of 8 years of relevant experience.
  • Higher-level degrees, such as a Master’s or Ph.D., may substitute for two years of experience. Relevant technical experience may be considered in lieu of formal education.
  • Expertise in microelectronic packaging for focal plane arrays or similar products.
  • Familiarity with die attach and adhesive technologies; interconnect methods including wire bonding, soldering, and flip chip hybridization; cleaning techniques such as vacuum bake, plasma etch, and liquid chemical processes; precision alignment; thin film deposition; thermal management; and structural design.
  • Understanding of assembly protocols in Class 100 cleanroom environments and contamination control.
  • Experience with optical bonding, coatings, and the use of optical lenses and filters.
  • Hands-on laboratory experience is essential.
  • Experience with vacuum and cryo-thermal systems.
  • Proficiency in MS Office applications.
  • Experience leading cross-disciplinary teams and managing schedules, budgets, and milestones.
  • Strong interpersonal and communication skills.

A security clearance or access with Polygraph is not a prerequisite for this position. However, the candidate must be willing and eligible for submission, depending on program requirements, after an offer is accepted and must be able to maintain the applicable clearance/access.

Preferred Education, Experience, & Skills:

  • A degree in Electrical Engineering, Physics, Material Science, Chemistry, or Mechanical Engineering is preferred.

Compensation Information:

Full-Time Salary Range: $182,500

Please note: This range is based on our market pay structures. Individual salaries are determined by various factors including business considerations, local market conditions, and internal equity, as well as candidate qualifications such as skills, education, and experience.

Employee Benefits: At BAE Systems, we prioritize our employees' well-being in all aspects of their lives, including health and financial security. Regular employees scheduled to work 20 hours per week are offered health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. Additional benefits include an employee assistance program, a legal plan, and discounts on various services. Our leave programs encompass paid time off, paid holidays, and other types of leave, including paid parental, military, bereavement, and applicable federal and state sick leave. Employees may also participate in the company recognition program to receive awards.

Engineer Senior Microelectronics Detector Packaging

102517BR

EEO Career Site Equal Opportunity Employer. Minorities, females, veterans, individuals with disabilities, sexual orientation, gender identity, gender expression.

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