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Senior Microelectronics Packaging Engineer

2 months ago


Boulder, Colorado, United States BAE Systems USA Full time

Job Overview

US CITIZENSHIP REQUIRED

This role presents a unique opportunity in the field of Detector Engineering. You will collaborate with a dedicated team of engineers and scientists focused on the design and production of micro-electronics packaging for focal plane arrays.

The Engineering, Science and Analysis (ESA) Strategic Capabilities Unit is composed of skilled professionals and leaders who drive the successful implementation of innovative technologies for our clients' missions. Our teams prioritize collaboration, integrity, continuous improvement, and effective execution.

Key Responsibilities:

  • Maintain a consistent and reliable work schedule.
  • Foster and sustain effective working relationships across departments, Strategic Business Units, and the broader organization. Engage with colleagues to promote a positive and productive workplace.
  • Perform additional duties as required.

On-Site Work Environment: This position necessitates regular in-person engagement, requiring you to work on-site five days a week at the primary location. Occasional travel and local commuting between company sites may be necessary.

Working Conditions:

  • Work may occur in various settings including offices, laboratories, production floors, cleanrooms, or outdoor research environments.
  • Occasional work in production areas may require the use of protective equipment.
  • Access to other facilities may be necessary under varying weather conditions.

Required Education, Experience, & Skills:

  • A Bachelor’s degree or higher in Engineering or a related technical discipline is required, along with a minimum of 8 years of relevant experience.
  • Higher degrees, such as a Master’s or Ph.D., may substitute for two years of experience. Relevant technical experience may be considered in lieu of formal education.
  • Expertise in microelectronic packaging for focal plane arrays or similar products.
  • Familiarity with die attach and adhesive technologies, interconnect methods (including wire bonding, soldering, and flip chip hybridization), and cleaning techniques (vacuum bake, plasma etch, and liquid chemical processes).
  • Understanding of precision alignment, thin film deposition, thermal management, and structural design.
  • Knowledge of assembly protocols in Class 100 cleanrooms and contamination control.
  • Experience with optical bonding, coatings, and the use of optical lenses and filters.
  • Hands-on laboratory experience is essential.
  • Experience with vacuum and cryo-thermal systems.
  • Proficiency in Microsoft Office applications.
  • Demonstrated experience leading cross-disciplinary teams and managing schedules, budgets, and project milestones.
  • Strong interpersonal and communication skills.

A security clearance or access with Polygraph is not mandatory for this position. However, candidates must be willing and eligible for submission based on program requirements after an offer is accepted and must maintain the necessary clearance/access.

Preferred Education, Experience, & Skills:

  • Degree in Electrical Engineering, Physics, Material Science, Chemistry, or Mechanical Engineering.

Compensation Information:

Full-Time Salary Range: $182,500

Please note: This range is based on market pay structures. Individual salaries are influenced by various factors including business considerations, local market conditions, and internal equity, as well as candidate qualifications such as skills, education, and experience.

Employee Benefits: At BAE Systems, we prioritize our employees' overall well-being, including health and financial security. Regular employees working 20 hours per week or more are eligible for health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. Additional benefits include an employee assistance program, legal plan, and discounts on home, auto, and pet insurance. Our leave programs encompass paid time off, holidays, and various types of leave, including parental, military, bereavement, and applicable sick leave. Employees may also participate in recognition programs for monetary or non-monetary awards. Other incentives may be available based on position level and job specifics.

EEO Career Site: Equal Opportunity Employer. Minorities, females, veterans, individuals with disabilities, sexual orientation, gender identity, and gender expression are encouraged to apply.