Assembler

4 days ago

Chelmsford, Massachusetts, United States Donatech Full time
Job Summary

Donatech is seeking a skilled Assembler to join our team. The successful candidate will be responsible for performing fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies.

Key Responsibilities
  • Perform gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals, and other microelectronic components.
  • Install substrates and components in highly complex microwave assemblies using paste and sheet epoxies.
  • Utilize measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications.
  • Collaborate with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
Requirements
  • Experience in wirebonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon).
  • Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers, and other similar tools.
  • Good dexterity and eye/hand coordination.
  • Experience in microelectronics assembly (chip and wire assembly).
  • Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities.
  • Ability to work in a diverse team environment; good interpersonal, teaming, and communication skills.
  • Active secret clearance preferred, willing to consider candidates with a previously held active clearance. Interim secret clearance required to start position.
  • High School Diploma required.
Preferred Skills
  • Experience in hybrid assembly in accordance with Mil STD 883.
  • Experience wirebonding or ribbon bonding to ceramic or duroid substrates.
  • Experience using Westbond and Metcal bonding machines and Unitech welder.
  • Experience in substrate and component attach, auto pick-and-place.
  • Experience operating auto or manual bonding equipment.
  • Familiarity working in an ESD and FOD controlled environment.
  • Experience in mechanical assembly processes of small electronic devices.
  • Experience working on military products in ISO 9001 / AS9100 controlled environments.

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