Hybrid Mechanical Assembler

4 days ago

Chelmsford, Massachusetts, United States Lockheed Martin Corporation Full time
Job Summary

We are seeking a highly skilled Hybrid Mechanical Assembler to join our team at Lockheed Martin Corporation. In this role, you will be responsible for performing fabrication or modification tasks on RF microwave hybrid microcircuits and subassemblies.

Key Responsibilities
  • Perform gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals, and other microelectronic components.
  • Wirebonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
  • Troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement.
  • Installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies.
  • Utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to ensure that the unit conforms to specifications.
  • Collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
Requirements
  • Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers, and other similar instruments.
  • Good dexterity and eye/hand coordination.
  • Experience in wirebonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon).
  • Experience in microelectronics assembly (chip and wire assembly).
  • Ability to read and work from detailed work instructions and drawings.
  • Computer skills are required to support retrieval of drawings and work instructions as well as other job activities.
  • Ability to obtain and maintain a Secret Security Clearance which requires U.S. citizenship.
Desired Skills
  • Experience in hybrid assembly in accordance with Mil-STD 883.
  • Experience wirebonding or ribbon bonding to ceramic or duroid substrates.
  • Experience using Westbond and Metcal bonding machines and Unitech welder.
  • Experience in substrate and component attach, auto pick-and-place.
  • Experience operating auto or manual bonding equipment.
  • Familiarity working in an ESD and FOD-controlled environment.
  • Experience in mechanical assembly processes of small electronic devices.
  • Experience working on military products in ISO 9001 / AS9100 controlled environments.
  • Ability to work in a diverse team environment.
  • Good interpersonal, teaming, and communication skills.
Security Clearance Statement

This position requires a government security clearance, you must be a US Citizen for consideration.

Other Important Information

By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match.

Should this match be identified you may be contacted for this and future openings.

The work associated with this position will be performed onsite at a designated Lockheed Martin facility.

Lockheed Martin supports a variety of alternate work schedules that provide additional flexibility to our employees.

Schedule for this Position: 4x10 hour day, 3 days off per week.

Lockheed Martin is an Equal Opportunity/Affirmative Action Employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.

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