Senior Staff Engineer Manufacturing/Packaging
5 days ago
We are seeking a highly skilled Senior Staff Engineer Manufacturing/Packaging to join our team at Ethan Alexander Group. As a key member of our organization, you will be responsible for defining substrate/package design rules, process flow, and material sets for new automotive power module packages.
Key Responsibilities- Design and Development: Define substrate/package design rules, process flow, and material sets for new automotive power module packages.
- Supplier Alignment: Drive alignment between module substrate (PCB) design requirements and supplier capabilities to enable new product development and volume manufacturing of power modules.
- Process Development: Develop new assembly technologies, run process DOEs, to define process windows for new package development.
- Reliability Testing: Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group.
- Collaboration: Work closely with offshore assembly and substrate partners to develop new processes.
- Package Design: Work closely with IC design teams to define package design rules and define packages to meet their requirements.
- Team Collaboration: Collaborate with multi-functional teams within Ethan Alexander Group for successful development, qualification, and production ramp of new module products.
- Education: BS Degree in Electrical Engineering, Mechanical Engineering, or Material Science.
- Experience: Minimum 12 years in semiconductor packaging technology.
- Lead Multi-Die Packages: Experience leading multi-die packages.
- Organic Laminate Technologies: Understanding of organic laminate technologies manufacturing and supplier capabilities.
- SMT or Passive Integrated Package Assembly: Experience in SMT or passive integrated package assembly is a plus.
- Packaging Processes: Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
- Package Substrate Design Rules: Experience with package substrate design rules, tools (including AutoCAD).
- Automotive Reliability Requirements: Knowledge of AEQ Automotive reliability requirements.
- APQP Automotive Development Process: Knowledge of APQP automotive development process
- JEDEC/IPC Design Standards: Knowledge of JEDEC/IPC design standards.
- Design Rule Checks: Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus.
- Travel: Travel to Asia to attend technology reviews and resolve subcon/supplier issues.
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