Senior Engineer, Advanced Packaging Feasibility Layout Design

2 months ago


San Jose, California, United States Samsung Semiconductor Full time

Senior Engineer, Advanced Packaging Feasibility Layout Design provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.Responsible for the advanced packaging design flow set-up, and design tool bring-up.Design and develop a package and interconnect methods in the areas of SiP/modules, wafer level, and multi-chip module.Bachelors in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 5+ years of experience or Masters in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 3+ Years of Industry Experience or PhD in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 0+ yrs of Industry Experience Preferred.Expert in package design tools: Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP), and/or Siemens Xpedition platform tools (XPD/XSI/XLM).An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.Give Back With a charitable giving match and frequent opportunities to get involved, we take an active role in supporting the community.Care for Family Whatever family means to you, we want to support you along the way—including a stipend for fertility care or adoption, medical travel support, and an errand service.



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