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Post Silicon Debug Pathfinding Engineer

1 month ago

Santa Clara, California, United States Intel Full time
Job Description

Intel's Post Silicon Debug technology pathfinding team is responsible for developing and identifying new technologies and methodologies to support physical debug analysis capabilities on next generation 3D package / 3DIC data center, client, and GPU products.

Responsibilities
  • Work with Intel product, process, and package pathfinding teams to identify capability needs and gaps.
  • Work with internal and external research ecosystem (Universities, National Labs, Equipment Suppliers) to identify new technologies to meet physical debug and fault isolation challenges.
  • Manage research programs and team members on research and development activities and design of experiments.
  • Work with government agencies on silicon debug strategic research initiatives.
  • Execution of experiments for new generations of physical debug technologies / platforms including NG ion beam technologies, device prep technologies, and emission / irradiation based transistor probe technologies.
  • Collaborating with the operation support team to develop and improve new debug processes for the current and next generation process nodes.
  • Working with circuit designers, component debug, and platform validation engineering on direct write device modification and node access strategies.
  • Working with process development engineers on developing best practices for defect analysis.
  • Good verbal and written communication skills, ability to create training, program updates, and quarterly report documentation.
  • Ability to work both independently and collaboratively with teams across multiple organization and geographies.
Qualifications
  • Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
  • Bachelor's or master's degree in electrical engineering, computer engineering, chemical engineering, material sciences, physics or any STEM related degree with 15+ years of related experience; or PhD degree in electrical engineering, computer engineering, chemical engineering, material sciences, physics, or any STEM related degree with 10+ years of related experience.
  • Desired Experience in the following areas:
    • Silicon
    • Device physics and integrated circuit knowledge.
    • Circuit design and layout.
    • Semiconductor fabrication process
    • Silicon and package physical failure analysis.
    • Circuit Edit applications or related fields.
    • Contactless probe technology:
      • e.g., IREM, LVP, LADA, LIT Thermal Imaging; OBIC, EBIC, etc.
      • Scanning Electron Microscopy, Transmission Electron Microscopy, Focused Ion Beam system operations.
      • UHV Vacuum technology.
      • Experience with government programs, e.g., DARPA, IARPA, DoD, DoC.
Contact Information

For additional questions, please contact your Recruiter.