Mechanical Engineer

2 weeks ago

Chippewa Falls, Wisconsin, United States Hewlett Packard Enterprise Full time

Position Overview:

The Mechanical / Thermal Engineer role is primarily an 'Onsite' position, with a focus on working from an HPE office.

About Hewlett Packard Enterprise:

Hewlett Packard Enterprise is a leading global edge-to-cloud organization that transforms the way individuals and businesses operate. We empower organizations to connect, safeguard, analyze, and leverage their data and applications across various environments, enabling them to derive actionable insights swiftly in today's intricate landscape. Our culture is centered around innovation and inclusivity, recognizing the value of diverse backgrounds and perspectives. We provide the flexibility to balance professional and personal commitments, fostering an environment where bold initiatives are encouraged, and collective success is prioritized.

Key Responsibilities:

  • Design, assess, and enhance materials, mechanical systems, and packaging solutions.
  • Conduct feasibility studies, design margin assessments, and validation testing for new and modified designs.
  • Lead and support architectural development and evaluation processes.
  • Analyze the reliability of materials, properties, designs, and production techniques.
  • Address thermal challenges associated with server designs, focusing on delivering cost-effective cooling solutions that excel in thermal and acoustic performance.
  • Engage in system-level thermal design, emphasizing fan and heatsink technology, materials science, fluid dynamics, and control logic.
  • Oversee initial concept development, mechanical design, and thermal simulation using appropriate software.
  • Interface with vendors to resolve various technical issues, with potential for some international travel.

Qualifications:

  • Bachelor's or Master's degree in Mechanical Engineering.
  • 4-6 years of experience in Mechanical or Thermal Design.
  • Proficiency in ProEngineer, Solidworks, or other 3D CAD software.

Additional Skills:

  • Strong analytical and problem-solving capabilities.
  • In-depth understanding of electronics packaging.
  • Experience in designing sheet metal and plastic components, along with associated production tooling.
  • Familiarity with CFD and thermal mockups for validating thermal solutions.
  • Enthusiasm for technology and a willingness to learn new skills and technologies.
  • Ability to assess and manage risks effectively.

What We Offer:

Health & Wellbeing: We provide a comprehensive suite of benefits to support the physical, financial, and emotional wellbeing of our team members and their families.

Personal & Professional Development: We invest in your career development, offering programs tailored to help you achieve your professional aspirations.

Diversity, Inclusion & Belonging: We are committed to fostering an inclusive environment that celebrates individual uniqueness and values diverse backgrounds.

Hewlett Packard Enterprise is an Equal Employment Opportunity employer.

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