Advanced Integration Engineer IV

2 weeks ago


Albany, New York, United States Nutanix Full time
Key Responsibilities
This role is situated at a cutting-edge technology center focused on nanotechnology advancements.

Core Technology Expertise:
- Wafer-to-wafer bonding techniques, including both fusion and hybrid methods
- Advanced heterogeneous wafer-level packaging
- Through Silicon Via (TSV) technology
- Die-to-wafer bonding processes
- Innovative substrate and chip-on-wafer stacking

Primary Duties:
- Collaborate with program managers, process engineers, and external stakeholders to seamlessly integrate complex silicon devices.
- Adhere to project timelines, employing structured problem-solving techniques to integrate numerous process steps into operational silicon devices.
- Engage in the fabrication and development of Back End Of Line (BEOL) processes and wafer-level packaging.

Experience should encompass comprehensive technology development, including:
- Process assumptions and ground rule generation
- Coordination and scheduling of test sites
- Setup, installation, and logistics for wafer processing
- Testing, characterization, and process debugging.

Provide innovative solutions to complex process challenges faced by external clients, addressing significant issues that impact the business unit's product line.

Contribute to strategic planning efforts that align research and development initiatives with the overall business objectives of the organization.

Functional Knowledge
- Expertise in integrating silicon devices across various sectors, including CMOS, power, packaging, and optical technologies
- Familiarity with fabrication operations
- Experience with SiView or other Manufacturing Execution Systems (MES)
- Comprehensive understanding of device technology
- Knowledge of SPX or Coventor is advantageous.
Leadership Skills
- Demonstrates leadership by example, capable of guiding small teams of process engineers or module integrators.
Problem-Solving Abilities
- Directs the resolution of complex business challenges using advanced analytical skills and sound judgment.
Impact

Influences departmental outcomes and supports cross-functional collaboration to enhance business performance.

Interpersonal Skills

Skilled in negotiation and influencing stakeholders at all levels, with a keen awareness of audience dynamics.

Exceptional written, verbal, and presentation communication skills are essential.
Proficiency in English is required.
This position mandates adherence to global standards of business conduct and compliance with ethical practices that reflect the core values of the organization.

Qualifications
Education:
A PhD in Materials Science or Electrical Engineering with a focus on semiconductors is preferred.
Years of Experience:
Relevant experience is required.
Time Type:
Full-time
Employee Type:
Regular Assignee
Travel Requirements:
Occasional travel, approximately 10%
Relocation:
Eligible for relocation
Salary Range:
$120,000 - $165,000

The salary for the selected candidate will be determined based on various factors, including location, job grade, and relevant experience, while ensuring internal equity among team members.

In addition to a comprehensive benefits package, candidates may qualify for additional compensation, such as bonuses and stock awards, where applicable.

The organization is an Equal Opportunity Employer committed to fostering diversity in the workplace. All qualified candidates will be considered for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran status, or any other legally protected status.



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