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Advanced Integration Process Engineer
2 months ago
Join TEL in exploring your next career opportunity. Below is an overview of the current position available.
Position Overview
Advanced Integration Process Engineer
At TEL Technology Center, America, LLC, we pride ourselves on being at the cutting edge of technology. Our team of experts is dedicated to integrating innovative solutions into our existing products and developing new tools that enhance our operational efficiencies. We embody TEL's commitment to world-class technology, positioning ourselves as leaders in the global marketplace.
Department Overview
The 3DI Technology Group at TTCA specializes in Heterogeneous Integration and critical module advancements, focusing on techniques such as Fusion and Hybrid Bonding at both wafer-to-wafer (W2W) and chip-to-wafer (C2W) levels, as well as Wafer Thinning and TSV formation essential for semiconductor manufacturing. Our mission is to refine processes and hardware for stacking integrated circuits, enabling advanced 3D applications, including CMOS image sensors, memory devices, and logic circuits. As a 3DI R&D Engineer, you will play a pivotal role in our team, driving advancements in wafer and die stacking technologies. Collaborating with fundamental R&D, process development, and technical marketing teams, you will help define the future of heterogeneous processes and equipment design in a dynamic global environment.
Key Responsibilities:
- Lead a team of researchers to achieve objectives in C2W or D2W.
- Align technical vision with organizational goals and develop strategic initiatives.
- Work independently while collaborating with cross-functional teams and joint development partners.
- Conduct fundamental research and process development, implementing innovative hardware concepts for 3DI solutions.
- Perform feasibility studies for process technologies through simulations and engineering experiments.
- Mentor and develop other technical leaders within the organization, exemplifying TEL's values.
- Provide deep technical expertise and support for various internal and external projects.
- Collaborate with business units to deliver necessary technical assistance.
- Ph.D. in Nanotechnology, Material Science, Mechanical, Chemical, or Electrical Engineering, Chemistry, or Physics.
- Over 6 years of experience in the semiconductor industry focused on research and development.
- Extensive knowledge and experience in advanced packaging techniques.
- Exceptional problem-solving and analytical abilities.
- Strong organizational skills with the capacity to manage multiple tasks and adapt to changing priorities.
- Familiarity with packaging roadmaps and business models across hardware stacks and services.
- Excellent communication skills, capable of conveying complex technical concepts to diverse audiences.
- A strong record of publications, patents, or contributions to industry standards is highly valued.
- Proven leadership experience in guiding cross-functional teams and fostering technical excellence.
- Fluency in English with outstanding verbal and written communication skills.
- A collaborative spirit and the ability to thrive in a multicultural team environment.
Benefits:
- Comprehensive Medical, Vision, and Dental Insurance.
- Paid Personal Leave.
- Holiday Time Off.
- 401k Retirement Plans with Employer Matching.
- Tuition Reimbursement Opportunities.
- Incentives for Healthy Lifestyles.
- Employee Assistance Programs.
As an Equal Opportunity Employer, TEL is committed to fostering a diverse and inclusive workplace. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, national origin, protected veteran status, disability status, sexual orientation, gender identity or expression, marital status, genetic information, or any other characteristic protected by law.
Compensation:
Salary ranges from $147,000 to $194,293.19, determined by various factors including location, experience, skills, and education. A comprehensive benefits package is offered, along with eligibility for bonuses and long-term incentives for certain roles. Further details about total compensation will be shared during the hiring process.
Diversity fosters innovation at TEL.