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Senior Process Integration Engineer
2 months ago
This role is based at the forefront of technology integration within a leading organization.
Core Areas of Expertise:
- Wafer-to-wafer bonding techniques, including both fusion and hybrid bonding
- Advanced heterogeneous wafer-level packaging
- Through Silicon Via (TSV) technology
- Die-to-wafer bonding methodologies
- Innovative substrate and chip-on-wafer stacking processes
Primary Duties:
- Collaborate with project managers, process engineers, and key stakeholders to seamlessly integrate intricate devices onto silicon wafers.
- Adhere to project timelines, employing structured problem-solving techniques to successfully amalgamate numerous process steps into operational devices on silicon.
- Engage in the fabrication and advancement of Back End Of Line (BEOL) processes and wafer-level packaging.
Ideal candidates will possess comprehensive experience in end-to-end technology development, which encompasses: process assumptions, ground rule formulation, test site coordination, scheduling, setup and installation, route pipe cleaning, wafer processing logistics, testing and characterization, as well as process debugging.
- Provide innovative solutions to tackle complex process challenges faced by external clients, addressing their High Value Problems (HVP) that pertain to the product line.
- Contribute to strategic planning efforts aimed at harmonizing research and development processes with the overarching business objectives of the unit and Product Business Group.
Functional Knowledge- Expertise in integrating silicon devices across diverse fields, including CMOS, power, packaging, and optical devices.
- Familiarity with FAB operations and MES systems like SiView.
- Demonstrated extensive understanding of device technology.
- Experience with SPX or Coventor is advantageous.
Leadership Skills
- Exemplify leadership by guiding small teams of process engineers or supporting module integrators.
Problem-Solving Abilities
- Navigate the resolution of highly intricate or atypical business challenges through advanced analytical reasoning and judgment.
Impact
- Influenced by segment and functional strategy, this role significantly affects departmental outcomes, business unit performance, or facilitates cross-functional collaboration to enhance business operations.
Interpersonal Skills- Skilled in negotiation and influencing stakeholders at the executive level and within external organizations; demonstrates awareness of audience dynamics.
- Strong written, verbal, and presentation communication skills are essential.
- Proficiency in English is required.
- This position necessitates adherence to global Standards of Business Conduct and compliance with these standards consistently, reflecting the core values of the organization.
Education:
- A PhD in Materials Science or Electrical Engineering with a semiconductor focus is preferred.
Years of Experience:
- Relevant experience is required.
Time Type:
- Full-time position.
Employee Type:
- Regular employee status.
Travel Requirements:
- Occasional travel, approximately 10% of the time.
Relocation:
- Eligible for relocation.
Salary Range:
- Competitive salary between $120,000 and $165,000, determined by various factors including location, experience, and internal equity considerations.
In addition to a comprehensive benefits package, candidates may qualify for additional compensation opportunities such as bonuses and stock awards, as applicable.
The organization is an Equal Opportunity Employer committed to fostering diversity in the workplace. All qualified applicants will be considered for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
