Principal/Senior Principal Microelectronic Packaging Mechanical Design Engineer

2 days ago


Baltimore, Maryland, United States Northrop Grumman Full time
Job Description

Job Summary:

We are seeking a highly skilled Principal/Senior Principal Mechanical Design Engineer for Microelectronic Packaging to join our team at Northrop Grumman Mission Systems. As a key member of our cross-functional team, you will be responsible for the design and development of cutting-edge AESA antenna hardware featured in our world-class radar, ESM, and communications systems.

Key Responsibilities:

  • Design, prototyping, and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.
  • Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing.
  • Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
  • Providing technical leadership and mentoring to less experienced personnel.

Requirements:

  • Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience, or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 9 years of applied experience in lieu of degree requirement.
  • U.S. Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.
  • Working knowledge of materials, specifications, manufacturing processes, and design tools utilized for multi-chip modules, PWBs, and CCAs.
  • Proficient with AutoCAD.
  • Familiarity with NX or other 3D modeling software.

Preferred Qualifications:

  • Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • Active DoD Secret Clearance or higher.
  • Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.
  • Familiarity with thermal and structural analysis considerations, methodologies, and software tools.
  • Experience with hands-on assembly and testing of prototype electronic hardware.
  • Experience in a technical leadership role on a cross-functional product development team.

Benefits:

  • Medical, Dental & Vision coverage.
  • 401k.
  • Educational Assistance.
  • Life Insurance.
  • Employee Assistance Programs & Work/Life Solutions.
  • Paid Time Off.
  • Health & Wellness Resources.
  • Employee Discounts.


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