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Principal/Senior Principal Microelectronic Packaging Mechanical Design Engineer
2 months ago
Job Summary:
We are seeking a highly skilled Principal/Senior Principal Mechanical Design Engineer for Microelectronic Packaging to join our team at Northrop Grumman. As a key member of our engineering team, you will be responsible for designing and developing cutting-edge microelectronic packaging solutions for our advanced electronic systems.
Key Responsibilities:
- Design and develop microelectronic packaging solutions for advanced electronic systems, including chip-scale packaging technologies and substrate/PWB layout.
- Collaborate with cross-functional teams, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing.
- Organize and prioritize tasks to accomplish project milestones within schedule and budgetary constraints.
- Provide technical leadership and mentoring to less experienced personnel.
Requirements:
- Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience, or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
- U.S. Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
- Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.
- Working knowledge of materials, specifications, manufacturing processes, and design tools utilized for multi-chip modules, PWBs, and CCAs.
- Proficient with AutoCAD.
- Familiarity with NX or other 3D modeling software.
Preferred Qualifications:
- Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
- Active DoD Secret Clearance or higher.
- Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.
- Familiarity with thermal and structural analysis considerations, methodologies, and software tools.
- Experience with hands-on assembly and testing of prototype electronic hardware.
- Experience in a technical leadership role on a cross-functional product development team.
Benefits:
- Medical, Dental & Vision coverage.
- 401k.
- Educational Assistance.
- Life Insurance.
- Employee Assistance Programs & Work/Life Solutions.
- Paid Time Off.
- Health & Wellness Resources.
- Employee Discounts.
