Senior IC Packaging Solutions Engineer

2 weeks ago


Santa Clara, California, United States Apple Full time
Overview

Are you passionate about precision and excellence in engineering? At Apple, we thrive on transforming innovative ideas into remarkable products and experiences. Our Hardware Technology Packaging team is at the forefront of designing and developing cutting-edge electronic packaging solutions for a variety of Apple devices, including iPhone, iPad, Mac, and more.

Key Responsibilities

As a Senior IC Packaging Solutions Engineer, you will:
  • Lead the physical design of packages and modules for System on Chip (SoC), Memory, RF, and cellular technologies.
  • Collaborate with cross-functional teams to assess the feasibility of new product packaging and System in Package (SiP) designs.
  • Establish and enhance design verification and automation strategies to optimize packaging processes.
  • Work closely with teams to refine package pin configurations.
  • Conduct S-parameter extraction and develop RLGC models for packages.
  • Ensure that package designs meet Signal Integrity (SI) and Power Integrity (PI) standards.
  • Drive innovation and efficiency improvements in packaging methodologies in partnership with vendors and developers.
  • Investigate and implement new CAD tools and design verification workflows.
  • Collaborate with the Silicon Product Development team to optimize chip floorplans and bump placements, minimizing package dimensions.

Essential Qualifications

To excel in this role, you should possess:
  • A solid foundation in electrical, materials, thermal, or mechanical engineering.
  • Experience with advanced packaging configurations and assembly/substrate technologies (e.g., wirebond, Package on Package).
  • Proficiency in package design using Cadence Allegro tools or Mentor Xpedition tools.
  • Basic knowledge of SI/PI tools, package model extraction, and S-parameter modeling.
  • Understanding of substrate manufacturing processes and design rules.
  • Familiarity with high-speed interfaces such as DDR, PCIe, and NAND.
  • Experience in a Unix environment and knowledge of scripting languages (e.g., PERL, Python, TCL).

Preferred Skills

Additional skills that would be advantageous include:
  • Experience with CAM350/Valor or Calibre tools and conducting package design reviews.
  • Knowledge of high-speed layout constraints and design for manufacturability.
  • Experience in RFIC and 5G package design, including schematic and layout.

Education & Experience

A Bachelor's degree is required, with a Master's degree preferred.

Compensation & Benefits

At Apple, we offer a competitive compensation package that includes base pay, stock options, and a comprehensive benefits program. Our employees enjoy medical and dental coverage, retirement benefits, and opportunities for professional development, including educational reimbursements.

Apple is committed to creating a diverse and inclusive workplace. We encourage applications from all qualified individuals without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.

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