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Senior IC Packaging Specialist

2 months ago

Santa Clara, California, United States Apple Full time

Overview:

Position ID:

Are you passionate about innovative technology and creating exceptional products? Our team is seeking a dedicated IC Packaging Specialist with meticulous attention to detail and a commitment to excellence to achieve remarkable outcomes.

In this crucial position, you will spearhead packaging concepts, take ownership of complex package selection, and optimize new product package structures and configurations.

Your responsibilities will encompass packaging integration and the development of packaging technologies across various projects, including System on Chip (SoC).


Key Responsibilities:
  • Lead the advancement of packaging technologies, including cutting-edge 2.5D and 3D packaging.
  • Collaborate with cross-functional teams to guide SoC package integration initiatives.
  • Innovate in package architecture and integration.
  • Partner with foundries and OSAT to transition packaging solutions from concept to high-volume manufacturing.
  • Propel the industry forward with sophisticated packaging solutions, new material innovations, and specifications.
  • 5% international travel may be required.
Qualifications:

We are looking for a candidate with substantial experience in the Semiconductor Packaging domain.

Proficiency in materials characterization and analysis is essential.

The ideal candidate will possess a solid understanding of Wafer Level Packaging, as well as 2.5D and 3D packaging technologies.

A general knowledge of packaging technologies, assembly processes, IC packaging materials, reliability standards, and failure analysis techniques is required.

Exceptional interpersonal skills and the ability to build strong business partnerships and collaborate with diverse teams and international suppliers are crucial.

The ability to work autonomously and manage projects with minimal oversight is expected.

We seek a solution-oriented engineer with a strong foundation in engineering principles.

Demonstrated experience with package design software such as APD and Virtuoso is preferred.

A solid understanding of memory packaging is also required.

Strong program management skills are essential.

A Bachelor’s degree and a minimum of 10 years of relevant industry experience are required.

Education & Experience:

A Bachelor’s degree is required, with a Master’s or PhD preferred.

Compensation & Benefits:

At Apple, base salary is one component of our comprehensive compensation package, which is determined within a range.

This structure allows for growth and advancement as you develop in your role.

The base salary range for this position is between $175,800 and $312,200, and your salary will be based on your skills, qualifications, experience, and location.

Apple employees have the opportunity to become shareholders through participation in Apple’s discretionary employee stock programs.

Employees are also eligible for discretionary restricted stock unit awards and can purchase Apple stock at a discount through the Employee Stock Purchase Plan.


Additional Benefits:

Comprehensive medical and dental coverage, retirement benefits, a variety of discounted products and services, and reimbursement for certain educational expenses related to career advancement at Apple are included.

This role may also be eligible for discretionary bonuses or commission payments, as well as relocation assistance.


Note:

Apple’s benefits, compensation, and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer committed to fostering inclusion and diversity.

We take proactive measures to ensure equal opportunity for all applicants, regardless of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, or other legally protected characteristics.

Learn more about your EEO rights as an applicant.