Senior IC Packaging Engineer

1 week ago


Santa Clara, California, United States Apple Full time

Position Overview

As a Senior IC Packaging Engineer, you will play a pivotal role in shaping the future of Apple’s hardware technology. Your expertise will be crucial in developing innovative packaging solutions for our cutting-edge consumer electronics.

Key Responsibilities

  • Design and implement physical configurations for System on Chip (SoC), Memory, RF, and cellular components.
  • Establish and refine design verification strategies to enhance package design workflows.
  • Collaborate with vendors and internal teams to drive improvements in package design methodologies.
  • Engage with cross-functional teams to assess the feasibility of new product packaging and integration.
  • Ensure that package designs meet stringent signal integrity and power integrity standards.
  • Research and develop new CAD tools and verification processes to streamline design efforts.
  • Participate in discussions regarding package architecture and technology roadmaps, working closely with silicon design teams.
  • Identify opportunities for cost reduction and performance enhancements in packaging solutions.
  • Conduct extraction of S-parameters and develop RLGC models for accurate performance assessment.

Minimum Qualifications

To be successful in this role, candidates should possess:

  • A Bachelor’s degree in a relevant field and over 10 years of hands-on experience in package design.
  • Proficiency in Cadence Allegro or Mentor Xpedition tools.
  • A solid foundation in electrical, material, thermal, and mechanical engineering principles.
  • Familiarity with advanced packaging configurations and assembly technologies.
  • Experience with signal integrity and power integrity tools, as well as package model extraction.
  • A good understanding of high-speed interface standards.
  • Exposure to scripting languages and Unix environments.
  • A proven track record in package selection and feasibility studies.

Preferred Qualifications

Additional experience that would be beneficial includes:

  • Experience with RFIC and 5G packaging design.
  • Knowledge of design rules for manufacturing and layout constraints.
  • Familiarity with schematic capture and system integration tools.

Compensation and Benefits

Apple offers a competitive compensation package that includes base salary, stock options, and comprehensive benefits. Employees have access to medical and dental coverage, retirement plans, and opportunities for professional development.

Apple is committed to fostering an inclusive and diverse workplace, ensuring equal opportunity for all applicants.



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