Thermal Solutions Engineer

1 week ago


Santa Clara, California, United States Apple Full time


Are you passionate about tackling unique challenges? Do you enjoy redefining the status quo? Imagine the possibilities you could explore here.

At Apple, we recognize that innovative ideas can rapidly transform into exceptional products, services, and customer experiences. Bring your enthusiasm and commitment to your role, and the potential for achievement is limitless.

We are in search of a driven and proactive individual who will collaborate with diverse teams to enhance the thermal efficiency of mobile devices and engage in cutting-edge IC packaging research and development.


Key Responsibilities:
Designing thermal strategies to improve chip energy efficiency and performance.
Delivering thermal modeling solutions for mobile devices at both silicon die and semiconductor package levels.
Refining advanced IC design layouts to ensure optimal thermal performance.
Creating comprehensive and simplified thermal models.
Evaluating simulation and measurement data to improve product thermal management.
Minimum Qualifications:
In-depth understanding of thermal conduction, convection, and radiation. Strong experimental and analytical capabilities.
Proven ability to lead and coordinate cross-functional teams to implement "design for thermal" initiatives.
Familiarity with at least one programming language (Python, Matlab, C++, etc.).
Master's or Doctoral degree in mechanical engineering.
Experience in modeling or analyzing transient thermal responses and reduced-order modeling.
Preferred Qualifications:
Significant experience in thermal analysis and modeling of System on Chip (SoC), IC packages, and mobile devices.
Knowledge of semiconductor, package, PCB, or mobile device design and thermal testing.
Experience with IC physical design parameters that influence electrical and thermal performance of packaging technologies.
Understanding of SoC design methodologies, low-power techniques, and thermal analysis methods.
Familiarity with advanced packaging assembly processes and the electrical and thermal characteristics of packages.

Tool Proficiency:
Experience with Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk, etc.
Background in data center cooling solution analysis, design, and testing.
Apple is an equal opportunity employer committed to fostering an inclusive and diverse workplace.

We take proactive measures to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.

Learn more about your EEO rights as an applicant.

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