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Equipment Development Engineer – Wafer Bonding

1 month ago

Boise ID United States Experis Full time

Our client's vision is to transform how the world uses information to enrich life for all.

Our client is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description
Equipment Development Engineer – Wafer Bonding

As an Equipment Development Engineer in TD's wafer bonding Tech Dev (TD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer bond equipment (bond, trim, grind, and others) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in TD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities.
You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for client products. You will grow into an expert engineer, driving wafer bonding technology roadmaps, which have a direct influence on our client’s global leadership in semiconductor manufacturing.

Responsibilities include, but not limited to:

  • Develop strategies and execute to improve Equipment maturity for First of a Kind (FOAK) hardware.
  • Develop hardware roadmaps for 5+ years in the area of wafer bonding (including bonding, trim, grinding).
  • Developing dielectric and hybrid bonding equipment to meet the physical and electrical requirements of client’s products.
  • Optimizing equipment to reduce cost, availability, and improve hardware and process capability.
  • Collaborating with process development teams to develop innovative new solutions.
  • Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive Bond development projects with OEMs vendors for solutions.
  • Performing fundamental research to drive innovative solutions for next-generation equipment products.
  • Support equipment transfer to production facilities (some domestic or international travel may be required).

Minimum Qualifications:
  • Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
  • Strong analytical and creative problem-solving skills.
  • Ability to use extensive technical knowledge to guide strategic directions.
  • Ability to resolve complex issues through root-cause or model-based problem solving.
  • Proficiency in statistics, preferably in statistical process control.
  • Ability to work independently, with minimal direction, and a focus on meeting commitments.
  • Ability to multi-task and manage numerous projects simultaneously.
  • Hands on experience with wafer bonding tools and overlay systems.
Education and Experience.
  • M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
  • 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding and packaging field
  • Experience in dielectrics/hybrid bond equipment development with fundamental understanding of bond process and equipment interactions.
  • Experience in wafer bonding process development and understanding of bonding related inline/electrical/probe failure.
  • Knowledge of semiconductor processing, solid-state device physics desir