Advanced Packaging Yield Engineer
3 weeks ago
Job Title: Advanced Packaging Yield Engineer
Job Code: 16920
Job Location: Palm Bay, FL
Job Description:
L3Harris Technologies is seeking a highly motivated Advanced Packaging Yield Engineer to join the Microelectronics Division at Palm Bay, FL location. As a member of our dynamic and collaborative environment, you will be responsible for developing semiconductor process controls and yield analysis techniques to support the production of advanced electronic systems from pilot-line to full-scale production.
Key Responsibilities:
- Develop and implement strategies to improve yield and reduce defects in the manufacturing of 2.5D/3D integrated packages from pilot-line through high-volume production.
- Partner with Process Integration and Design Engineering teams to develop Process Control Monitor (PCM) and electronic test structure strategies.
- Work multifunctionally with Design, Technology Development, and Manufacturing teams to ensure seamless integration of yield simulation results and yield optimization techniques.
- Continuously evaluate PCM, inline statistical process control (SPC), and electrical performance data and provide recommendations to improve yield, enhance product quality, and meet cost targets.
Qualifications:
- Bachelor's Degree and minimum 9 years of prior relevant experience; or Graduate Degree and a minimum of 7 years of prior related experience.
- 5+ years experience within the semiconductor industry focused on advanced packaging yield engineering.
- Ability to obtain a Top Secret Clearance.
- Ability to travel domestically and/or internationally 25% or more.
Preferred Additional Skills:
- 10+ years experience in the advanced packaging industry.
- Previous experience in one or more of the following semiconductor process areas: lithography, wet etch, dry etch, deposition, CMP, metrology, etc.
- Hold an Active Top Secret Clearance.
- Experience working in classified government programs.
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