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Advanced Packaging Yield Engineer
1 month ago
Job Summary:
L3Harris Technologies is seeking a highly motivated Advanced Packaging Yield Engineer to join the Microelectronics Division at our Palm Bay, FL location. As a member of our dynamic and collaborative environment, you will be responsible for developing semiconductor process controls and yield analysis techniques to support the production of advanced electronic systems from pilot-line to full-scale production.
Key Responsibilities:
- Develop and implement strategies to improve yield and reduce defects in the manufacturing of 2.5D/3D integrated packages from pilot-line through high-volume production.
- Develop and implement state-of-the-art yield simulation techniques for advanced package processes and systems.
- Partner with Process Integration and Design Engineering teams to develop Process Control Monitor (PCM) and electronic test structure strategies.
- Work multifunctionally with Design, Technology Development, and Manufacturing teams to ensure seamless integration of yield simulation results and yield optimization techniques.
- Keep current with industry trends and advancements in advanced packaging yield analysis and simulation techniques.
- Continuously evaluate PCM, inline statistical process control (SPC), and electrical performance data and provide recommendations to improve yield, enhance product quality, and meet cost targets.
- Assist in troubleshooting product- and design-limited yield issues using structured problem-solving methods to ensure high-quality, cost-effective production.
- Develop and maintain accurate and detailed documentation of yield simulation processes and results.
- Prepare detailed reports and presentations for management, project stakeholders, and customers highlighting yield trends, project progress, and yield improvement opportunities.
- Ensure compliance with all safety and quality standards.
- Stay organized and meet project deadlines in a fast-paced environment.
- Coach and mentor junior engineers on yield optimization and simulation techniques.
- Maintain a positive attitude and contribute to a collaborative and inclusive work environment.
- Represent the company and its values in a professional and ethical manner.
- Maintain a safe and organized work environment.
Requirements:
- Bachelor's Degree and minimum 9 years of prior relevant experience; or Graduate Degree and a minimum of 7 years of prior related experience.
- Degree concentration in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field.
- 5+ years' experience within the semiconductor industry focused on advanced packaging yield engineering.
- Ability to obtain a Top Secret Clearance.
- Ability to travel domestically and/or internationally 25% or more.
- Subject matter expert with comprehensive knowledge in advanced packaging.
- Strong leadership skills and experience in managing cross-functional teams.
- In-depth knowledge of project management.
Preferred Additional Skills:
- 10+ years' experience in the advanced packaging industry.
- Previous experience in one or more of the following semiconductor process areas: lithography, wet etch, dry etch, deposition, CMP, metrology, etc.
- Hold an Active Top Secret Clearance.
- Experience working in classified government programs.
- Extensive expertise in using statistical software and tools for data analysis, such as JMP, Minitab, or Python.
- Excellent problem-solving skills and the ability to work effectively in a fast-paced and evolving environment.
- Flexibility with job responsibilities and pro-active with assuming additional responsibilities related to scope.
- Strong collaboration skills focused on positive team dynamics and the ability to communicate effectively across multi-functional teams.
- Ability to effectively prioritize multiple sophisticated and complex tasks.
- Tenacity to work effectively under tight timelines and limited resources.
- Ability to work with minimal direction with a strong sense of responsibility, ownership, and follow-through.
- Employ a growth mindset and seek opportunities to work multi-functionally, network, and gain competency across domains.
