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Thermal Systems Engineer

2 months ago


Santa Clara, California, United States Apple Full time

Overview:

Role Identifier:

Are you passionate about tackling complex challenges? Do you enjoy innovating and redefining the status quo? Imagine the possibilities you could explore here.

At Apple, we are convinced that fresh ideas can swiftly evolve into remarkable products, services, and customer experiences. With enthusiasm and commitment to your role, the potential for achievement is limitless.

We seek a driven and proactive professional who will collaborate with cross-functional teams to enhance the thermal efficiency of mobile devices and engage in cutting-edge IC packaging research and development.

Key Responsibilities:

- Designing thermal solutions to improve chip energy efficiency and performance scalability.
- Providing thermal modeling solutions for mobile devices at both silicon die and semiconductor package levels.
- Optimizing advanced IC design schemes and floor-planning to ensure superior thermal performance.
- Developing comprehensive and reduced-order thermal models.
- Analyzing simulation and measurement data to improve product thermal management.


Minimum Qualifications:

- Profound understanding of thermal conduction, convection, and radiation.
- Strong analytical and experimental capabilities.
- Proven ability to lead and coordinate cross-functional teams to implement "design for thermal" strategies.
- Familiarity with at least one programming language (Python, Matlab, C++, etc.).
- Master’s or Doctoral degree in mechanical engineering.


Preferred Qualifications:

- Extensive experience in thermal analysis and modeling of System on Chip (SoC), IC packages, and mobile devices.
- Knowledge of semiconductor, package, PCB, or mobile device design and thermal testing.
- Experience with IC physical design parameters impacting electrical and thermal performance of packaging technologies.
- Understanding of SoC design methodologies, low-power techniques, and thermal analysis methods.
- Familiarity with advanced packaging assembly processes and the electrical and thermal characteristics of packages.


Tools and Technologies:
- Proficiency in Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk, etc.
- Experience in data center cooling solution analysis, design, and testing.

Compensation & Benefits:
At Apple, base pay is one component of our overall compensation package and is determined within a specified range. This allows for growth and advancement as you develop in your role.

The base pay range for this position is between $175,800 and $312,200, and your base pay will be influenced by your skills, qualifications, experience, and location.

Apple employees have the opportunity to become shareholders through participation in Apple's discretionary employee stock programs.

Employees are also eligible for discretionary restricted stock unit awards and can purchase Apple stock at a discount through the Employee Stock Purchase Plan.


Additional Benefits:

- Comprehensive medical and dental coverage.
- Retirement benefits.
- A variety of discounted products and free services.
- Reimbursement for certain educational expenses related to career advancement at Apple, including tuition.

This role may also be eligible for discretionary bonuses or commission payments, as well as relocation assistance. Learn more about Apple Benefits.

Note:

Apple’s benefits, compensation, and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer committed to fostering inclusion and diversity.

We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.

Learn more about your EEO rights as an applicant.