Principal Mechanical Packaging Design Engineer

9 hours ago

Baltimore, Maryland, United States Northrop Grumman Full time
Job Title: Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer

Northrop Grumman Mission Systems is seeking a highly skilled Principal / Senior Principal Mechanical Electronic Packaging Engineer to join our team of innovative and dedicated professionals. This position will be located in Linthicum, Maryland.

Job Summary:

We are looking for a talented engineer to design and develop cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems. As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.

Key Responsibilities:
  • Design and prototyping of MCMs, PWBs, and CCAs using various substrate materials and chip-scale packaging technologies
  • Collaboration with cross-functional teams, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing
  • Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints
  • Providing technical leadership and mentoring to less experienced personnel
Requirements:
  • Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience, or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields
  • U.S. Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout
  • Working knowledge of materials, specifications, manufacturing processes, and design tools utilized for MCMs, PWBs, and CCAs
  • Proficient with AutoCAD
  • Familiarity with NX or other 3D modeling software
Preferred Qualifications:
  • Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields
  • Active DoD Secret Clearance or higher
  • Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
  • Familiarity with thermal and structural analysis considerations, methodologies, and software tools
  • Experience with hands-on assembly and testing of prototype electronic hardware
  • Experience in a technical leadership role on a cross-functional product development team
Benefits:
  • Medical, Dental & Vision coverage
  • 401k
  • Educational Assistance
  • Life Insurance
  • Employee Assistance Programs & Work/Life Solutions
  • Paid Time Off
  • Health & Wellness Resources
  • Employee Discounts

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