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Principal Mechanical Electronic Packaging Engineer

1 month ago

Baltimore, Maryland, United States Northrop Grumman Full time
Job Title: Principal Mechanical Electronic Packaging Engineer

We are seeking a highly skilled Principal Mechanical Electronic Packaging Engineer to join our team at Northrop Grumman Mission Systems. As a key member of our cross-functional team, you will be responsible for the design and development of cutting-edge AESA antenna hardware that is featured in our world-class radar, ESM, and communications systems.

Key Responsibilities:
  • Design, prototyping, and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.
  • Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing.
  • Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
  • Providing technical leadership and mentoring to less experienced personnel.
Requirements:
  • Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience, or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • U.S. Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.
  • Working knowledge of materials, specifications, manufacturing processes, and design tools utilized for multi-chip modules, PWBs, and CCAs.
  • Proficient with AutoCAD.
  • Familiarity with NX or other 3D modeling software.
Preferred Qualifications:
  • Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • Active DoD Secret Clearance or higher.
  • Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.
  • Familiarity with thermal and structural analysis considerations, methodologies, and software tools.
  • Experience with hands-on assembly and testing of prototype electronic hardware.
  • Experience in a technical leadership role on a cross-functional product development team.

This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher and contract award. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.