Principal Mechanical Electronic Packaging Engineer

7 days ago

Baltimore, Maryland, United States Northrop Grumman Full time
Job Title: Principal / Senior Principal Mechanical Electronic Packaging Engineer

We are seeking a highly skilled Principal / Senior Principal Mechanical Electronic Packaging Engineer to join our team at Northrop Grumman Mission Systems. This position will be located in Linthicum, Maryland.

Job Summary:

The successful candidate will work as part of a cross-functional team responsible for the design and development of cutting-edge AESA antenna hardware featured in Northrop Grumman's world-class radar, ESM, and communications systems. This role will support multiple projects spanning the product lifecycle, from R&D to full-rate production.

Key Responsibilities:
  • Design, prototyping, and production support of state-of-the-art RF, digital, and mixed-signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.
  • Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing.
  • Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
  • Providing technical leadership and mentoring to less experienced personnel.
Requirements:
  • Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience, or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 9 years of applied experience in lieu of degree requirement.
  • U.S. Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate PWB layout.
  • Working knowledge of materials, specifications, manufacturing processes, and design tools utilized for MCMs, PWBs, and CCAs.
  • Proficient with AutoCAD.
  • Familiarity with NX or other 3D modeling software.
Preferred Qualifications:
  • Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • Active DoD Secret Clearance or higher.
  • Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.
  • Familiarity with thermal and structural analysis considerations, methodologies, and software tools.
  • Experience with hands-on assembly and testing of prototype electronic hardware.
  • Experience in a technical leadership role on a cross-functional product development team.
Benefits:
  • Medical, Dental & Vision coverage.
  • 401k.
  • Educational Assistance.
  • Life Insurance.
  • Employee Assistance Programs & Work/Life Solutions.
  • Paid Time Off.
  • Health & Wellness Resources.
  • Employee Discounts.

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