Hybrid Mechanical Assembler

5 days ago

Chelmsford, Massachusetts, United States Lockheed Martin Full time
About the Role

We are seeking a highly skilled Hybrid Mechanical Assembler to join our team at Lockheed Martin's Chelmsford Operations facility. As a key member of our microelectronics team, you will be responsible for performing fabrication and modification tasks on RF microwave hybrid microcircuits and subassemblies.

Key Responsibilities
  • Perform gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals, and other microelectronic components.
  • Wirebonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
  • Troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement.
  • Installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies.
  • Utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to ensure that the unit conforms to specifications.
  • Collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
Requirements
  • Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers, and other similar instruments.
  • Good dexterity and eye/hand coordination.
  • Experience in wirebonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon).
  • Experience in microelectronics assembly (chip and wire assembly).
  • Ability to read and work from detailed work instructions and drawings.
  • Computer skills are required to support retrieval of drawings and work instructions as well as other job activities.
  • Ability to obtain and maintain a Secret Security Clearance which requires U.S. citizenship.
Preferred Qualifications
  • Experience in hybrid assembly in accordance with Mil-STD 883.
  • Experience wirebonding or ribbon bonding to ceramic or duroid substrates.
  • Experience using Westbond and Metcal bonding machines and Unitech welder.
  • Experience in substrate and component attach, auto pick-and-place.
  • Experience operating auto or manual bonding equipment.
  • Familiarity working in an ESD and FOD-controlled environment.
  • Experience in mechanical assembly processes of small electronic devices.
  • Experience working on military products in ISO 9001 / AS9100 controlled environments.
  • Ability to work in a diverse team environment.
  • Good interpersonal, teaming, and communication skills.
About Lockheed Martin

Lockheed Martin is a leading hub for innovation in microelectronics, supporting critical aerospace and defense programs. Our team is dedicated to producing advanced technology solutions that safeguard national security and advance the industry.

Why Work with Us

At Lockheed Martin, we invest in people and promoting the sharing of ideas to create incredible solutions. We know that our success depends on the combined efforts of diverse thinkers like you. We cultivate an inclusive environment that appreciates differences and unique thinking.

Security Clearance

This position requires a government security clearance, you must be a US Citizen for consideration.

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