Package Design Engineering Lead

3 weeks ago

Mountain View, United States Groq Full time
At Groq. We believe in an AI economy powered by human agency. We envision a world where AI is accessible to all, a world that demands processing power that is better, faster, and more affordable than is available today. AI applications are currently constrained by the limitations of the Graphics Processing Unit (GPU), a technology originally developed for the gaming market and soon to become the weakest link in the AI economy.

Enter Groq's LPU™ Inference Engine. Specifically engineered for the demands of large language models (LLMs), the Language Processing Unit outpaces the GPU in speed, power, efficiency, and cost-effectiveness. The quickest way to understand the opportunity is to watch the following talk - groq.link/scspdemo.

Why join Groq? AI will change humanity forever, and we believe preservation of human agency and self determination is only possible if AI is made affordably and universally accessible. Groq's LPUs will power AI from an early stage, and you will get to leave your fingerprint on civilization.

Package Design Engineering Lead

Mission: toLead Groq's efforts for Package Design Engineering and drive the end to end efforts from concept to NPI

Responsibilities & opportunities in this role:
  • Lead chip package design process including chip PAD ring, define substrate interconnect scheme
  • Drive packaging effort end to end from concept to NPI, HVM, meet Cost/Manufacturability/Signal integrity/Flip chip assembly, Mechanical & Thermal requirements
  • Co-work with chip design team to optimize package design via chip floorplan, bump and package ball out, stack up and physical routing based on system requirements
  • Co-work with chip design, product engineering teams to come up with optimum substrate/ RDL solution to meet schedule/cost/component and system level requirements
  • Work closely with Foundry and OSAT partners to develop and bring up new substrate/ RDL technology from definition to prototyping to HVM
  • Own and execute Flip chip packages in single chip, 2.5D/3D in material optimization, NPI, CPI, package qualifications of component and board level, failure analysis
  • Drive definition of DFM/DFT/DOE/FMEA , material selection, improving critical process window
Ideal candidates have/are:
  • Bachelors or M.S. in Electrical Engineering, Mechanical Engineering or Material science required
  • 10 or more years of industry experience/exposure with hands on experience in Semiconductor Packaging Design, Process and Technology Development
  • Hands on experience in industry standard tools like Cadence APD/Allegro
  • HVM experience with RDL designs for advanced packaging solutions
  • Ability to build strong relationships
  • Good written and oral communication skills; strong technical documentation skills
  • Good interpersonal skills; a history of mentoring junior engineers and interns a huge plus
  • Highly self-motivated and directed; self-confidence and self-starter
  • Keen attention to detail
  • Proven analytical and problem-solving abilities
  • Ability to effectively prioritize and execute tasks in a high-pressure environment
  • Experience working in a team-oriented, collaborative environment
Attributes of a Groqster:
  • Humility - Egos are checked at the door
  • Collaborative & Team Savvy - We make up the smartest person in the room, together
  • Growth & Giver Mindset - Learn it all versus know it all, we share knowledge generously
  • Curious & Innovative - Take a creative approach to projects, problems, and design
  • Passion, Grit, & Boldness - no limit thinking, fueling informed risk taking

If this sounds like you, we'd love to hear from you

Compensation: At Groq, a competitive base salary is part of our comprehensive compensation package, which includes equity and benefits. For this role, the base salary range is $208,800 to $420,400, determined by your skills, qualifications, experience and internal benchmarks.

Location: Groq is a geo-agnostic company, meaning you work where you are. Exceptional candidates will thrive in asynchronous partnerships and remote collaboration methods. Some roles may require being located near our primary sites, as indicated in the job description.

At Groq: Our goal is to hire and promote an exceptional workforce as diverse as the global populations we serve. Groq is an equal opportunity employer committed to diversity, inclusion, and belonging in all aspects of our organization. We value and celebrate diversity in thought, beliefs, talent, expression, and backgrounds. We know that our individual differences make us better.

Groq is an Equal Opportunity Employer that is committed to inclusion and diversity. Qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, disability or protected veteran status. We also take affirmative action to offer employment opportunities to minorities, women, individuals with disabilities, and protected veterans.

Groq is committed to working with qualified individuals with physical or mental disabilities. Applicants who would like to contact us regarding the accessibility of our website or who need special assistance or a reasonable accommodation for any part of the application or hiring process may contact us at: talent@groq.com. This contact information is for accommodation requests only. Evaluation of requests for reasonable accommodations will be determined on a case-by-case basis. #LI-Remote

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