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Principal High Speed Design Engineer

4 months ago

Folsom, United States Micron Full time

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description

Our Opportunity Summary:

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

We are looking for an HBM High-Speed Design Engineer. Are you passionate about designing circuits for the next generation of memory that will power groundbreaking AI applications?

You will work in an innovative and dynamic team and will be responsible for designing and analyzing high-speed circuits for DRAM and interface die. This includes simulating, optimizing, and floor planning circuits. In this position, you will collaborate with Micron’s worldwide design and verification teams and support the efforts of multi-functional teams such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to proactively design HBM products that optimize all manufacturing functions and assure the best performance, power, cost, quality, reliability, time-to-market, and customer satisfaction. The seniority level offered will be based on the combination of experience and education.

In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.

Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies Enabling the creative career path you deserve with a collaborative environment and groundbreaking technology and growing upon your imagination and creativity.

(Disclaimer): While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.

What’s Encouraged Daily:

Collaborate with the architecture team and external customers on new product specifications

Pathfinding to explore new system-level solutions for future HBM products and make recommendations after performing highly technical feasibility analyses

Drive interface logic chip and memory architecture solutions

Design and develop high-speed interface PHY and its sub-block such as high-speed data paths, command/address decode, input buffer, output buffer, calibration, training, control, test, loopback, clock domain crossing, etc.

Drive innovation into the future Memory generation with a dynamic work environment

Provide advice and counsel to senior management on significant technical issues

Chip in expert knowledge to advance innovative technical solutions

Coordinate and own the layout process, including placement and routing optimization

Contribute to cross-group communication to work towards standardization and group success

Mentor and coach other design team members on technical issues.

Maintain technical expertise and provide training.

How To Qualify:

BSEE or Greater

5+ years of relevant job/skill-related experience

Circuit design experience in analog/mixed-signal CMOS circuits in High-Speed Interfaces (for example DDR3/4/5, LPDDR3/4x/5, GDDR5/6)

Prior experience in taking full ownership of at least one of the sub-blocks like high-speed data path, command/address decode, input buffer, output buffer, serializer/deserializer, CDR, PLL, and DLL.

Experience with various CDR and Clocking architecture.

Working knowledge of Mixed mode simulation, Signal Integrity, and ESD.

Good verbal and written communication skills with the ability to efficiently synthesize and convey complex technical concepts to other partners and leadership

Consistent track record of innovation and problem-solving in high-speed design development

What Sets You Apart:

Experience with managing/leading a team

Experience with IP design/architecture

Knowledge of Verilog and static timing analysis

Excellent problem-solving and analytical skills

A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds

Having an innovative approach that is open to improving upon any of our processes or products.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$153, - $280,

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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