Principal Packaging Architect
2 days ago
ARM is seeking a highly skilled Principal Packaging Architect to join our System Integration team. As a key member of our team, you will collaborate with various departments, including IP, SoC Design, Package Design, Signal Integrity, Power Integrity, Thermal, Thermomechanical Test, and Systems teams, to develop innovative packaging solutions that meet the company's goals.
The ideal candidate will have a strong understanding of package failure mechanisms and causes, as well as expertise in package standards, 2.xD, 3D, and other chiplet packaging methodologies. They will also have knowledge of signal integrity, power integrity, thermal, and thermomechanical principles, as well as depth of knowledge in memory interfaces such as HBM3, GDDR6, etc.
Responsibilities will include:
- Pathfinding activities with new programs to optimize the system-level solution space
- Identifying innovative technologies that maximize the performance of ARM architectures
- Collaborating with internal and external customer partners on silicon-disaggregation and other chiplet strategies for advanced packages, including emerging-memory chiplet integration
- Identifying critical elements for ARM's packaging roadmap and disseminating these use strategies to key partners
- Driving design strategies for performance and manufacturability in packaging
- Working closely with external partners for driving successful assembly prototypes
The successful candidate will have a minimum of 12 years of experience in package engineering, including advanced multichip system-in-package work. They will also have excellent interpersonal skills, strong initiative, and the ability to engage and learn new concepts and share with collaborators.
In return, ARM offers a dynamic and innovative work environment, opportunities for professional growth and development, and a competitive compensation package.
Key Skills and Qualifications:
- Strong understanding of package failure mechanisms and causes
- Expertise in package standards, 2.xD, 3D, and other chiplet packaging methodologies
- Knowledge of signal integrity, power integrity, thermal, and thermomechanical principles
- Depth of knowledge in memory interfaces such as HBM3, GDDR6, etc.
- Minimum 12 years of experience in package engineering, including advanced multichip system-in-package work
Preferred Qualifications:
- Excellent interpersonal skills
- Strong initiative
- Ability to engage and learn new concepts and share with collaborators
ARM is an Equal Opportunities Employer
ARM is committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.
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