Senior Mechanical Design Engineer Electronics Packaging Specialist

3 days ago


New York, New York, United States Trispoke managed services Full time
Job Title: Senior Mechanical Design Engineer Electronics Packaging

Trispoke managed services is seeking a highly skilled Senior Mechanical Design Engineer Electronics Packaging to join our team. As a key member of our engineering team, you will be responsible for designing and analyzing complex mechanical systems for electronics packaging.

Key Responsibilities:
  • Develop and transition best-in-class aviation electronics flight hardware to market.
  • Design and analyze the structural and thermal performance of electronic systems.
  • Provide technical leadership to personnel supporting assigned projects.
  • Participate in proposal development as a mechanical packaging expert, steering the mechanical design, thermal vibration, and other environmental design philosophy.
  • Develop and/or review design concepts, CAD models, ICDs, and assembly drawings.
  • Assure proper documentation of technical data generated for assigned projects and/or tasks, consistent with engineering policies and procedures.
  • Prepare data items for projects, including thermal vibration, mechanical tolerance, and others.
  • Be responsible for meeting cost, schedule, and technical requirements.
  • Participate as a presenter or reviewer in technical and program reviews.
Requirements:
  • Bachelor's degree in Mechanical Engineering from an accredited institution.
  • Minimum 5 years of experience in mechanical design and analysis of complex mechanical systems, with electronics systems experience a plus.
  • Ability to access United States Export Controlled information.
Preferred Qualifications:
  • Experience in the Aerospace industry.
  • Proficiency in the use of NX or other modern solid modeling tools for complex 3D part and assembly modeling.
  • Proficiency in ANSYS (Finite Element Analysis (FEA)).
  • Familiarity with ANSYS ICEPAK (CFD/thermal analysis).
  • Familiarity with ANSYS Sherlock.
  • Capable of performing steady-state and transient thermal analysis using FEA software such as ANSYS Workbench.
  • Understanding of shock and random vibration as it relates to electronic boxes and PCBs.
  • Experience performing deflection and vibration analysis on printed circuit cards (PCB).
  • Knowledgeable in the application and interpretation of GD&T principles in ASME Y14.5.
  • Proficiency in Worst Case RSS and 6Sigma tolerance analysis of mechanical parts.
  • Demonstrated proficiency in the creation and composition of engineering drawings according to applicable industry standards using modern CAD drafting tools.
  • Familiarity with basic electrical engineering principles and the application and use of electrical connectors and other interconnect products.
  • Experience designing and creating solid 3D models using CAD software (prefer UG Unigraphics experience).
  • Experience interpreting customer requirements and familiarity with industry standards.
  • Understanding of tolerance stack-up analysis.
  • Experience with solder fatigue analysis.


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