Principal Semiconductor Backside Lead Engineer

1 week ago

Massachusetts USA, United States Raytheon Full time

Job Summary

We are seeking a highly skilled Principal Semiconductor Backside Lead Engineer to join our Advanced Microelectronics Solutions Department at Raytheon. As a technical lead, you will be responsible for achieving foundry metrics in the Backside Processing Work Center and supporting production efforts through lot deposition, process sustainment, RCCA, and process improvement activities.

Key Responsibilities

  • Develop, improve, and sustain backside wafer processes, including wafer bond and de-bond, wafer thinning, and singulation.
  • Lead capital procurement and qualification efforts as they arise.
  • Collaborate with cross-functional teams to drive process improvements and ensure compliance with regulatory requirements.
  • Provide technical guidance and support to junior engineers and technicians.
  • Stay up-to-date with industry trends and emerging technologies to ensure the department remains competitive.

Requirements

  • Bachelor's degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 8 years' of prior work experience or an Advanced Degree in a related field and minimum 5 years' of prior work experience.
  • Experience with semiconductor backside processing, including wafer bond and de-bond, wafer thinning, and singulation.
  • Experience developing and/or sustaining semiconductor toolsets and processes.
  • Ability to obtain and maintain a U.S. government issued security clearance.

Preferred Qualifications

  • Experience with III-V compound semiconductor processing and devices.
  • Experience in design of experiments and use of statistical data analysis and statistical process control (SPC).
  • Experience leading and coordinating project work in a team environment.
  • Experience creating, documenting, maintaining, and approving work instructions.

What We Offer

  • A competitive salary range of $96,000 - $200,000.
  • A comprehensive benefits package, including medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays.
  • Opportunities for professional growth and development.

Clearance Information

This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process.

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