IC Package Design Engineer

2 days ago

Irvine, California, United States Apple Full time
Job Title: IC Package Design Engineer

At Apple, we're looking for a talented IC Package Design Engineer to join our Hardware Technology Packaging team. As a key member of our team, you'll be responsible for inventing, designing, developing, and integrating electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products.

Key Responsibilities:
  • Own and drive sophisticated package selection, new generation product package structure, and configuration optimization.
  • Implement the physical design of packages and modules for SoC, Memory, RF, and cellular chips.
  • Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design, and selection.
  • Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.
  • Work multi-functionally to optimize package pin out.
  • Perform extraction of S-parameters and package RLGC model.
  • Ensure package design is optimized with SI/PI requirements.
  • Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
  • Explore, evaluate, and develop new CAD tool, design, and verification flow.
  • Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.
Requirements:
  • BS and 3+ years of relevant industry experience.
  • Proven fundamentals in the electrical/material/thermal/or mechanical engineering field(s).
  • Familiarity with various sophisticated package configurations and assembly/substrate technology (wirebond, POP, etc.).
  • Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
  • Basic knowledge of substrate manufacturing process, structure, design rules, and material property.
  • Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
  • Exposure to Unix environment, scripting languages (PERL, Python, TCL, and/or shell) and methodology.
Preferred Skills:
  • Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
  • Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
  • Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
  • Solid understanding of Design Rules Check and Design for Manufacturing.
Additional Requirements:

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $135,400 and $250,600, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan.

Benefits include comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition.

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