Semiconductor IC Package Design Engineer
3 days ago
Broadcom, a leading semiconductor company, is seeking a talented IC package design professional to support its growing business needs.
This position requires a candidate with 8 years of relevant experience and a BS degree, 6 years with a MS degree, or 3 years with a PhD degree.
The ideal candidate will have skills in physical design (place & route) of an IC package, with experience in 2.5D/3D IC package design highly preferred.
Additional relevant skills include experience and knowledge in silicon design, advanced package technology, CMOS technology, HPC product thermal solutions, and package-level reliability analysis.
Compensation and Benefits:The annual base salary range for this position is $119,000 - $190,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package, including medical, dental, and vision plans, 401(K) participation, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave, and vacation time.
The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer, considering qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status, or any other characteristic protected by federal, state, or local law.
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